System and apparatus for heat dissipation in an electronic device

A system for the dissipation of heat in at least one electronic device in a home network comprises at least one electronic device connected to a central unit ( 100 ) by a link ( 60 a, 60 b, 60 c, 60 d) comprising means ( 40 a, 40 b, 40 c, 40 d) able to transport data. This system is such that the he...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	MERLET HERVE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	MERLET HERVE
description	A system for the dissipation of heat in at least one electronic device in a home network comprises at least one electronic device connected to a central unit ( 100 ) by a link ( 60 a, 60 b, 60 c, 60 d) comprising means ( 40 a, 40 b, 40 c, 40 d) able to transport data. This system is such that the heat dissipation is obtained by circulation of air through the link connecting the electronic device to the central unit. More particularly, the system and apparatus of the invention are situated in a home communications network comprising multimedia connection interfaces and an interconnection module.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7027301B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7027301B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7027301B23</originalsourceid><addsrcrecordid>eNqNyjEKwkAQBdBtLES9w1xAiEmRWkWxj9Zh2P3Bgbg77IyCt9fCA1i95i3Dfnib40GcE7EqV_an0VQq3cFOScxE2aVkkvxdhBnRa8kSKeElEeuwmHg2bH6uAp1P1-NlCy0jTDkiw8fb0Ddt3zW7Q9v9UT6ktDFZ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>System and apparatus for heat dissipation in an electronic device</title><source>esp@cenet</source><creator>MERLET HERVE</creator><creatorcontrib>MERLET HERVE</creatorcontrib><description>A system for the dissipation of heat in at least one electronic device in a home network comprises at least one electronic device connected to a central unit ( 100 ) by a link ( 60 a, 60 b, 60 c, 60 d) comprising means ( 40 a, 40 b, 40 c, 40 d) able to transport data. This system is such that the heat dissipation is obtained by circulation of air through the link connecting the electronic device to the central unit. More particularly, the system and apparatus of the invention are situated in a home communications network comprising multimedia connection interfaces and an interconnection module.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060411&DB=EPODOC&CC=US&NR=7027301B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060411&DB=EPODOC&CC=US&NR=7027301B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MERLET HERVE</creatorcontrib><title>System and apparatus for heat dissipation in an electronic device</title><description>A system for the dissipation of heat in at least one electronic device in a home network comprises at least one electronic device connected to a central unit ( 100 ) by a link ( 60 a, 60 b, 60 c, 60 d) comprising means ( 40 a, 40 b, 40 c, 40 d) able to transport data. This system is such that the heat dissipation is obtained by circulation of air through the link connecting the electronic device to the central unit. More particularly, the system and apparatus of the invention are situated in a home communications network comprising multimedia connection interfaces and an interconnection module.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjEKwkAQBdBtLES9w1xAiEmRWkWxj9Zh2P3Bgbg77IyCt9fCA1i95i3Dfnib40GcE7EqV_an0VQq3cFOScxE2aVkkvxdhBnRa8kSKeElEeuwmHg2bH6uAp1P1-NlCy0jTDkiw8fb0Ddt3zW7Q9v9UT6ktDFZ</recordid><startdate>20060411</startdate><enddate>20060411</enddate><creator>MERLET HERVE</creator><scope>EVB</scope></search><sort><creationdate>20060411</creationdate><title>System and apparatus for heat dissipation in an electronic device</title><author>MERLET HERVE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7027301B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MERLET HERVE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MERLET HERVE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>System and apparatus for heat dissipation in an electronic device</title><date>2006-04-11</date><risdate>2006</risdate><abstract>A system for the dissipation of heat in at least one electronic device in a home network comprises at least one electronic device connected to a central unit ( 100 ) by a link ( 60 a, 60 b, 60 c, 60 d) comprising means ( 40 a, 40 b, 40 c, 40 d) able to transport data. This system is such that the heat dissipation is obtained by circulation of air through the link connecting the electronic device to the central unit. More particularly, the system and apparatus of the invention are situated in a home communications network comprising multimedia connection interfaces and an interconnection module.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US7027301B2
source	esp@cenet
subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	System and apparatus for heat dissipation in an electronic device
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T22%3A44%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MERLET%20HERVE&rft.date=2006-04-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS7027301B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true