Printed circuit board having outer power planes
A multi-layer printed circuit board (PCB) routes signal traces on internal signal layer(s) and includes power planes on the two outermost layers. The outer layers are maintained at the same non-ground voltage level, and are electrically connected by a series of vias that circumscribe signal traces o...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HARDIN KEITH BRYAN FESSLER JOHN THOMAS WESTERFIELD ERIC WAYNE |
| description | A multi-layer printed circuit board (PCB) routes signal traces on internal signal layer(s) and includes power planes on the two outermost layers. The outer layers are maintained at the same non-ground voltage level, and are electrically connected by a series of vias that circumscribe signal traces on the internal layer(s). With a preferred maximum spacing of one-tenth the wavelength of electromagnetic energy generated by the signal traces, the vias, together with the outer power planes, contain electromagnetic energy within the PCB. One or more of the outer planes may include a second power plane area maintained at a different voltage. The two power plane areas are connected by decoupling capacitors, located proximate underlying signal traces that traverse the two power plane areas. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7016198B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7016198B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7016198B23</originalsourceid><addsrcrecordid>eNrjZNAPKMrMK0lNUUjOLEouzSxRSMpPLEpRyEgsy8xLV8gvLUktUijILweROYl5qcU8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSQ-NNjcwNDM0NLCyciYCCUA6u0q1Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Printed circuit board having outer power planes</title><source>esp@cenet</source><creator>HARDIN KEITH BRYAN ; FESSLER JOHN THOMAS ; WESTERFIELD ERIC WAYNE</creator><creatorcontrib>HARDIN KEITH BRYAN ; FESSLER JOHN THOMAS ; WESTERFIELD ERIC WAYNE</creatorcontrib><description>A multi-layer printed circuit board (PCB) routes signal traces on internal signal layer(s) and includes power planes on the two outermost layers. The outer layers are maintained at the same non-ground voltage level, and are electrically connected by a series of vias that circumscribe signal traces on the internal layer(s). With a preferred maximum spacing of one-tenth the wavelength of electromagnetic energy generated by the signal traces, the vias, together with the outer power planes, contain electromagnetic energy within the PCB. One or more of the outer planes may include a second power plane area maintained at a different voltage. The two power plane areas are connected by decoupling capacitors, located proximate underlying signal traces that traverse the two power plane areas.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060321&DB=EPODOC&CC=US&NR=7016198B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060321&DB=EPODOC&CC=US&NR=7016198B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HARDIN KEITH BRYAN</creatorcontrib><creatorcontrib>FESSLER JOHN THOMAS</creatorcontrib><creatorcontrib>WESTERFIELD ERIC WAYNE</creatorcontrib><title>Printed circuit board having outer power planes</title><description>A multi-layer printed circuit board (PCB) routes signal traces on internal signal layer(s) and includes power planes on the two outermost layers. The outer layers are maintained at the same non-ground voltage level, and are electrically connected by a series of vias that circumscribe signal traces on the internal layer(s). With a preferred maximum spacing of one-tenth the wavelength of electromagnetic energy generated by the signal traces, the vias, together with the outer power planes, contain electromagnetic energy within the PCB. One or more of the outer planes may include a second power plane area maintained at a different voltage. The two power plane areas are connected by decoupling capacitors, located proximate underlying signal traces that traverse the two power plane areas.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAPKMrMK0lNUUjOLEouzSxRSMpPLEpRyEgsy8xLV8gvLUktUijILweROYl5qcU8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSQ-NNjcwNDM0NLCyciYCCUA6u0q1Q</recordid><startdate>20060321</startdate><enddate>20060321</enddate><creator>HARDIN KEITH BRYAN</creator><creator>FESSLER JOHN THOMAS</creator><creator>WESTERFIELD ERIC WAYNE</creator><scope>EVB</scope></search><sort><creationdate>20060321</creationdate><title>Printed circuit board having outer power planes</title><author>HARDIN KEITH BRYAN ; FESSLER JOHN THOMAS ; WESTERFIELD ERIC WAYNE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7016198B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HARDIN KEITH BRYAN</creatorcontrib><creatorcontrib>FESSLER JOHN THOMAS</creatorcontrib><creatorcontrib>WESTERFIELD ERIC WAYNE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HARDIN KEITH BRYAN</au><au>FESSLER JOHN THOMAS</au><au>WESTERFIELD ERIC WAYNE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Printed circuit board having outer power planes</title><date>2006-03-21</date><risdate>2006</risdate><abstract>A multi-layer printed circuit board (PCB) routes signal traces on internal signal layer(s) and includes power planes on the two outermost layers. The outer layers are maintained at the same non-ground voltage level, and are electrically connected by a series of vias that circumscribe signal traces on the internal layer(s). With a preferred maximum spacing of one-tenth the wavelength of electromagnetic energy generated by the signal traces, the vias, together with the outer power planes, contain electromagnetic energy within the PCB. One or more of the outer planes may include a second power plane area maintained at a different voltage. The two power plane areas are connected by decoupling capacitors, located proximate underlying signal traces that traverse the two power plane areas.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US7016198B2 |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Printed circuit board having outer power planes |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T12%3A32%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HARDIN%20KEITH%20BRYAN&rft.date=2006-03-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS7016198B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |