Marking wafers using pigmentation in a mounting tape

Marking wafers using pigmentation in a mounting tape

Wafer level techniques for marking the back surfaces of integrated circuit devices are described. A wafer mounting tape is provided that includes releasable pigments. The pigments can be released by exposing the mounting tape to a selected frequency of electromagnetic radiation (e.g., UV light). The...

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Hauptverfasser: PATWARDHAN VIRAJ A, KELKAR NIKHIL VISHWANATH
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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator PATWARDHAN VIRAJ A
KELKAR NIKHIL VISHWANATH
description Wafer level techniques for marking the back surfaces of integrated circuit devices are described. A wafer mounting tape is provided that includes releasable pigments. The pigments can be released by exposing the mounting tape to a selected frequency of electromagnetic radiation (e.g., UV light). The released pigments mark the back surface of the wafer. The exposure and pigmentation may be controlled using a variety of techniques including servo control of a light source, the use of masks or reticles or other suitable techniques. The marking may be done on any suitable back surface material including polymeric backcoatings, metalized films or directly on semiconductor materials.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7015064B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7015064B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7015064B13</originalsourceid><addsrcrecordid>eNrjZDDxTSzKzsxLVyhPTEstKlYoLQZxCjLTc1PzShJLMvPzFDLzFBIVcvNL80pAUiWJBak8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSQ-NNjcwNDUwMzEydCYCCUA52Mskg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Marking wafers using pigmentation in a mounting tape</title><source>esp@cenet</source><creator>PATWARDHAN VIRAJ A ; KELKAR NIKHIL VISHWANATH</creator><creatorcontrib>PATWARDHAN VIRAJ A ; KELKAR NIKHIL VISHWANATH</creatorcontrib><description>Wafer level techniques for marking the back surfaces of integrated circuit devices are described. A wafer mounting tape is provided that includes releasable pigments. The pigments can be released by exposing the mounting tape to a selected frequency of electromagnetic radiation (e.g., UV light). The released pigments mark the back surface of the wafer. The exposure and pigmentation may be controlled using a variety of techniques including servo control of a light source, the use of masks or reticles or other suitable techniques. The marking may be done on any suitable back surface material including polymeric backcoatings, metalized films or directly on semiconductor materials.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060321&amp;DB=EPODOC&amp;CC=US&amp;NR=7015064B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060321&amp;DB=EPODOC&amp;CC=US&amp;NR=7015064B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PATWARDHAN VIRAJ A</creatorcontrib><creatorcontrib>KELKAR NIKHIL VISHWANATH</creatorcontrib><title>Marking wafers using pigmentation in a mounting tape</title><description>Wafer level techniques for marking the back surfaces of integrated circuit devices are described. A wafer mounting tape is provided that includes releasable pigments. The pigments can be released by exposing the mounting tape to a selected frequency of electromagnetic radiation (e.g., UV light). The released pigments mark the back surface of the wafer. The exposure and pigmentation may be controlled using a variety of techniques including servo control of a light source, the use of masks or reticles or other suitable techniques. The marking may be done on any suitable back surface material including polymeric backcoatings, metalized films or directly on semiconductor materials.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDxTSzKzsxLVyhPTEstKlYoLQZxCjLTc1PzShJLMvPzFDLzFBIVcvNL80pAUiWJBak8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSQ-NNjcwNDUwMzEydCYCCUA52Mskg</recordid><startdate>20060321</startdate><enddate>20060321</enddate><creator>PATWARDHAN VIRAJ A</creator><creator>KELKAR NIKHIL VISHWANATH</creator><scope>EVB</scope></search><sort><creationdate>20060321</creationdate><title>Marking wafers using pigmentation in a mounting tape</title><author>PATWARDHAN VIRAJ A ; KELKAR NIKHIL VISHWANATH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7015064B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PATWARDHAN VIRAJ A</creatorcontrib><creatorcontrib>KELKAR NIKHIL VISHWANATH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PATWARDHAN VIRAJ A</au><au>KELKAR NIKHIL VISHWANATH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Marking wafers using pigmentation in a mounting tape</title><date>2006-03-21</date><risdate>2006</risdate><abstract>Wafer level techniques for marking the back surfaces of integrated circuit devices are described. A wafer mounting tape is provided that includes releasable pigments. The pigments can be released by exposing the mounting tape to a selected frequency of electromagnetic radiation (e.g., UV light). The released pigments mark the back surface of the wafer. The exposure and pigmentation may be controlled using a variety of techniques including servo control of a light source, the use of masks or reticles or other suitable techniques. The marking may be done on any suitable back surface material including polymeric backcoatings, metalized films or directly on semiconductor materials.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Marking wafers using pigmentation in a mounting tape
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T04%3A37%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=PATWARDHAN%20VIRAJ%20A&rft.date=2006-03-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS7015064B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true