Thermal pole-tip recession/slide shape variation reduction

A bond pad is elevated from a slider body by a conductive post. The bond pad is disposed atop the post, which typically possesses a cross-sectional area smaller than the surface are of the bond pad. Thus, rather than having the entire surface of the bond pad in contact with the slider body, only the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	STOVER LANCE EUGENE, ZHU JIANXIN, JONES GORDON MERLE
Format:	Patent
Sprache:	eng
Schlagworte:	INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER PHYSICS
Online-Zugang:	Volltext bestellen
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