Stress accommodation in electronic device interconnect technology for millimeter contact locations

The providing of an array interface of conductive joint members for use in forming interconnections between mating surfaces such as a pad on a surface mount electronic device and contacts on a circuit card where one portion of the conductive joint members are of a relatively elongated or oval outlin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	COTEUS PAUL WILLIAM, BLACKSHEAR EDMUND DAVID, CIPOLLA THOMAS MARIO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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