Protected electrical interconnect assemblies
The described embodiments relate to electrical interconnect assemblies and methods of forming same. One exemplary method applies a generally flowable protective material to an electrical interconnect region comprising portions of at least two conductors. The method also exposes the protective materi...
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| creator | SWIER WAYNE K CLARKE LEO C |
| description | The described embodiments relate to electrical interconnect assemblies and methods of forming same. One exemplary method applies a generally flowable protective material to an electrical interconnect region comprising portions of at least two conductors. The method also exposes the protective material to conditions sufficient to render the protective material to a generally non-flowable state which protects the electrical interconnect region from degradation, wherein said exposing also reflows solder positioned proximate the electrical interconnect region to allow the solder to bond with the at least two conductors. |
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One exemplary method applies a generally flowable protective material to an electrical interconnect region comprising portions of at least two conductors. The method also exposes the protective material to conditions sufficient to render the protective material to a generally non-flowable state which protects the electrical interconnect region from degradation, wherein said exposing also reflows solder positioned proximate the electrical interconnect region to allow the solder to bond with the at least two conductors.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CORRECTION OF TYPOGRAPHICAL ERRORS ; CURRENT COLLECTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINE CONNECTORS ; LINING MACHINES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PRINTING ; SELECTIVE PRINTING MECHANISMS ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050614&DB=EPODOC&CC=US&NR=6905342B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050614&DB=EPODOC&CC=US&NR=6905342B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SWIER WAYNE K</creatorcontrib><creatorcontrib>CLARKE LEO C</creatorcontrib><title>Protected electrical interconnect assemblies</title><description>The described embodiments relate to electrical interconnect assemblies and methods of forming same. One exemplary method applies a generally flowable protective material to an electrical interconnect region comprising portions of at least two conductors. The method also exposes the protective material to conditions sufficient to render the protective material to a generally non-flowable state which protects the electrical interconnect region from degradation, wherein said exposing also reflows solder positioned proximate the electrical interconnect region to allow the solder to bond with the at least two conductors.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CORRECTION OF TYPOGRAPHICAL ERRORS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</subject><subject>LINE CONNECTORS</subject><subject>LINING MACHINES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PRINTING</subject><subject>SELECTIVE PRINTING MECHANISMS</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJKMovSU0uSU1RSM0B0kWZyYk5Cpl5JalFyfl5eUARhcTi4tTcpJzM1GIeBta0xJziVF4ozc2g4OYa4uyhm1qQH59aXJCYnJqXWhIfGmxmaWBqbGLkZGRMhBIAjNoqNQ</recordid><startdate>20050614</startdate><enddate>20050614</enddate><creator>SWIER WAYNE K</creator><creator>CLARKE LEO C</creator><scope>EVB</scope></search><sort><creationdate>20050614</creationdate><title>Protected electrical interconnect assemblies</title><author>SWIER WAYNE K ; CLARKE LEO C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6905342B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CORRECTION OF TYPOGRAPHICAL ERRORS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</topic><topic>LINE CONNECTORS</topic><topic>LINING MACHINES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PRINTING</topic><topic>SELECTIVE PRINTING MECHANISMS</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>SWIER WAYNE K</creatorcontrib><creatorcontrib>CLARKE LEO C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SWIER WAYNE K</au><au>CLARKE LEO C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Protected electrical interconnect assemblies</title><date>2005-06-14</date><risdate>2005</risdate><abstract>The described embodiments relate to electrical interconnect assemblies and methods of forming same. One exemplary method applies a generally flowable protective material to an electrical interconnect region comprising portions of at least two conductors. The method also exposes the protective material to conditions sufficient to render the protective material to a generally non-flowable state which protects the electrical interconnect region from degradation, wherein said exposing also reflows solder positioned proximate the electrical interconnect region to allow the solder to bond with the at least two conductors.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CORRECTION OF TYPOGRAPHICAL ERRORS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINE CONNECTORS LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS |
| title | Protected electrical interconnect assemblies |
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