Manufacturing methods for printed circuit boards

A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substrate, applying a first photoresist...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KLODOWSKI MICHAEL JOSEPH, BUPP JAMES RUSSELL, KEESLER ROSS WILLIAM, FARQUHAR DONALD SETON, SCHILD GARY LEE, APPELT BERND KARL-HEINZ, SEMAN ANDREW MICHAEL
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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