Method and apparatus for controlling a multi-chamber processing tool

A method for controlling a processing tool having a plurality of chambers includes processing a wafer in a first chamber of the processing tool; measuring a characteristic of the wafer; and modifying an operating recipe of one of the plurality of chambers based on the measured characteristic. A syst...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ALLEN, JR. SAM H, CONBOY MICHAEL R, GROVER JASON A
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ALLEN, JR. SAM H
CONBOY MICHAEL R
GROVER JASON A
description A method for controlling a processing tool having a plurality of chambers includes processing a wafer in a first chamber of the processing tool; measuring a characteristic of the wafer; and modifying an operating recipe of one of the plurality of chambers based on the measured characteristic. A system for processing semiconductor wafers includes a processing tool, a metrology tool, and a process controller. The processing tool includes a plurality of chambers. The metrology tool is adapted to measure a characteristic of a wafer processed in a first chamber of the processing tool. The process controller is adapted to modify an operating recipe of one of the plurality of chambers based on the measured characteristic.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6895295B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6895295B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6895295B13</originalsourceid><addsrcrecordid>eNrjZHDxTS3JyE9RSMwD4oKCxKLEktJihbT8IoXk_LySovycnMy8dIVEhdzSnJJM3eSMxNyk1CKFgqL85NTiYpBUSX5-Dg8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0uSExOzUstiQ8NNrOwNDWyNHUyNCZCCQBv2DLw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method and apparatus for controlling a multi-chamber processing tool</title><source>esp@cenet</source><creator>ALLEN, JR. SAM H ; CONBOY MICHAEL R ; GROVER JASON A</creator><creatorcontrib>ALLEN, JR. SAM H ; CONBOY MICHAEL R ; GROVER JASON A</creatorcontrib><description>A method for controlling a processing tool having a plurality of chambers includes processing a wafer in a first chamber of the processing tool; measuring a characteristic of the wafer; and modifying an operating recipe of one of the plurality of chambers based on the measured characteristic. A system for processing semiconductor wafers includes a processing tool, a metrology tool, and a process controller. The processing tool includes a plurality of chambers. The metrology tool is adapted to measure a characteristic of a wafer processed in a first chamber of the processing tool. The process controller is adapted to modify an operating recipe of one of the plurality of chambers based on the measured characteristic.</description><edition>7</edition><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CALCULATING ; CINEMATOGRAPHY ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050517&amp;DB=EPODOC&amp;CC=US&amp;NR=6895295B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050517&amp;DB=EPODOC&amp;CC=US&amp;NR=6895295B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ALLEN, JR. SAM H</creatorcontrib><creatorcontrib>CONBOY MICHAEL R</creatorcontrib><creatorcontrib>GROVER JASON A</creatorcontrib><title>Method and apparatus for controlling a multi-chamber processing tool</title><description>A method for controlling a processing tool having a plurality of chambers includes processing a wafer in a first chamber of the processing tool; measuring a characteristic of the wafer; and modifying an operating recipe of one of the plurality of chambers based on the measured characteristic. A system for processing semiconductor wafers includes a processing tool, a metrology tool, and a process controller. The processing tool includes a plurality of chambers. The metrology tool is adapted to measure a characteristic of a wafer processed in a first chamber of the processing tool. The process controller is adapted to modify an operating recipe of one of the plurality of chambers based on the measured characteristic.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CALCULATING</subject><subject>CINEMATOGRAPHY</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDxTS3JyE9RSMwD4oKCxKLEktJihbT8IoXk_LySovycnMy8dIVEhdzSnJJM3eSMxNyk1CKFgqL85NTiYpBUSX5-Dg8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0uSExOzUstiQ8NNrOwNDWyNHUyNCZCCQBv2DLw</recordid><startdate>20050517</startdate><enddate>20050517</enddate><creator>ALLEN, JR. SAM H</creator><creator>CONBOY MICHAEL R</creator><creator>GROVER JASON A</creator><scope>EVB</scope></search><sort><creationdate>20050517</creationdate><title>Method and apparatus for controlling a multi-chamber processing tool</title><author>ALLEN, JR. SAM H ; CONBOY MICHAEL R ; GROVER JASON A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6895295B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CALCULATING</topic><topic>CINEMATOGRAPHY</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>ALLEN, JR. SAM H</creatorcontrib><creatorcontrib>CONBOY MICHAEL R</creatorcontrib><creatorcontrib>GROVER JASON A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ALLEN, JR. SAM H</au><au>CONBOY MICHAEL R</au><au>GROVER JASON A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and apparatus for controlling a multi-chamber processing tool</title><date>2005-05-17</date><risdate>2005</risdate><abstract>A method for controlling a processing tool having a plurality of chambers includes processing a wafer in a first chamber of the processing tool; measuring a characteristic of the wafer; and modifying an operating recipe of one of the plurality of chambers based on the measured characteristic. A system for processing semiconductor wafers includes a processing tool, a metrology tool, and a process controller. The processing tool includes a plurality of chambers. The metrology tool is adapted to measure a characteristic of a wafer processed in a first chamber of the processing tool. The process controller is adapted to modify an operating recipe of one of the plurality of chambers based on the measured characteristic.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US6895295B1
source esp@cenet
subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CALCULATING
CINEMATOGRAPHY
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
title Method and apparatus for controlling a multi-chamber processing tool
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T21%3A17%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ALLEN,%20JR.%20SAM%20H&rft.date=2005-05-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS6895295B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true