Method of manufacturing semiconductor package including forming a resin sealing member

In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KONNO TAKAFUMI, FUJISAWA ATSUSHI, OHSAKA SHINGO, ICHITANI MASAHIRO, HARUTA RYO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!