Method for detecting the reliability of integrated semiconductor components at high temperatures

The invention relates to a device and a method for detecting the reliability of integrated semiconductor components. The device includes a carrier substrate for receiving an integrated semiconductor component that will be examined, a heating element, and a temperature sensor. The temperature sensor...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ASAM WILHELM, HAGEN JOCHEN VON, MARTIN ANDREAS, SMEETS DAVID, FAZEKAS JOSEF
Format:	Patent
Sprache:	eng
Schlagworte:	AMPLIFIERS BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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