Carrier with a metal area and at least one chip configured on the metal area

A carrier has a metal area that is essentially composed of copper. A chip has a rear side metallization layer. A buffer layer, essentially composed of nickel and having a thickness of between 5 mum and 10 mum, is arranged on the metal area. The chip does not have a chip housing and is arranged on th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RAPPL HANS, GROSS KURT
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!