Protecting resin-encapsulated components
A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temp...
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| creator | CHEN QINGPING WHEELER DAVID ALEXANDER STOLARSKI CHRIS LESSNER PHILLIP MICHAEL KINARD JOHN TONY PRITCHARD KIM MELODY BRIAN JOHN PERSICO DANIEL F HARRINGTON ALBERT KENNEDY |
| description | A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin. |
| format | Patent |
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The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050118&DB=EPODOC&CC=US&NR=6845004B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050118&DB=EPODOC&CC=US&NR=6845004B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN QINGPING</creatorcontrib><creatorcontrib>WHEELER DAVID ALEXANDER</creatorcontrib><creatorcontrib>STOLARSKI CHRIS</creatorcontrib><creatorcontrib>LESSNER PHILLIP MICHAEL</creatorcontrib><creatorcontrib>KINARD JOHN TONY</creatorcontrib><creatorcontrib>PRITCHARD KIM</creatorcontrib><creatorcontrib>MELODY BRIAN JOHN</creatorcontrib><creatorcontrib>PERSICO DANIEL F</creatorcontrib><creatorcontrib>HARRINGTON ALBERT KENNEDY</creatorcontrib><title>Protecting resin-encapsulated components</title><description>A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. 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The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAIKMovSU0uycxLVyhKLc7M003NS04sKC7NSSxJTVFIzs8tyM9LzSsp5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8aHBZhYmpgYGJk5GxkQoAQDP6SjD</recordid><startdate>20050118</startdate><enddate>20050118</enddate><creator>CHEN QINGPING</creator><creator>WHEELER DAVID ALEXANDER</creator><creator>STOLARSKI CHRIS</creator><creator>LESSNER PHILLIP MICHAEL</creator><creator>KINARD JOHN TONY</creator><creator>PRITCHARD KIM</creator><creator>MELODY BRIAN JOHN</creator><creator>PERSICO DANIEL F</creator><creator>HARRINGTON ALBERT KENNEDY</creator><scope>EVB</scope></search><sort><creationdate>20050118</creationdate><title>Protecting resin-encapsulated components</title><author>CHEN QINGPING ; WHEELER DAVID ALEXANDER ; STOLARSKI CHRIS ; LESSNER PHILLIP MICHAEL ; KINARD JOHN TONY ; PRITCHARD KIM ; MELODY BRIAN JOHN ; PERSICO DANIEL F ; HARRINGTON ALBERT KENNEDY</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6845004B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN QINGPING</creatorcontrib><creatorcontrib>WHEELER DAVID ALEXANDER</creatorcontrib><creatorcontrib>STOLARSKI CHRIS</creatorcontrib><creatorcontrib>LESSNER PHILLIP MICHAEL</creatorcontrib><creatorcontrib>KINARD JOHN TONY</creatorcontrib><creatorcontrib>PRITCHARD KIM</creatorcontrib><creatorcontrib>MELODY BRIAN JOHN</creatorcontrib><creatorcontrib>PERSICO DANIEL F</creatorcontrib><creatorcontrib>HARRINGTON ALBERT KENNEDY</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN QINGPING</au><au>WHEELER DAVID ALEXANDER</au><au>STOLARSKI CHRIS</au><au>LESSNER PHILLIP MICHAEL</au><au>KINARD JOHN TONY</au><au>PRITCHARD KIM</au><au>MELODY BRIAN JOHN</au><au>PERSICO DANIEL F</au><au>HARRINGTON ALBERT KENNEDY</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Protecting resin-encapsulated components</title><date>2005-01-18</date><risdate>2005</risdate><abstract>A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Protecting resin-encapsulated components |
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