Method for fabricating semiconductor device

After forming a resist pattern on an insulating film deposited on a semiconductor substrate, the insulating film is subjected to plasma etching using an etching gas including carbon and fluorine with the resist pattern used as a mask. A polymer film having been deposited on the resist pattern during...

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Bibliographische Detailangaben

1. Verfasser:	KANEGAE KENSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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