Composite capacitor and stiffener for chip carrier

A chip package comprises a substrate with a composite capacitor/stiffener on the substrate. In one embodiment of the present invention, the substrate comprises a plurality of dielectric layers and a plurality of metallic layers interlaced with the dielectric layers. One of the metallic layers is on...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIBOUS JAMES PATRICK, MILEWSKI JOSEPH MARYAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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