Heat dissipation from IC interconnects

The present invention relates to dissipating heat from an interconnect formed in a low thermal conductivity dielectric in an integrated circuit apparatus. The integrated circuit apparatus includes integrated circuit devices interconnected by conductive interconnection metallurgy and input/output pad...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SULLIVAN TIMOTHY D, WYNNE JEAN E, MOTSIFF WILLIAM T, YANKEE SALLY J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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