Heat exchanger having a manifold plate structure

The invention relates to a heat exchanger having a manifold plate structure. The heat exchanger comprises a first and a second manifold plate. The first and second manifold plates allow a refrigerant communication between an outside of the heat exchanger and another plate. The manifold plates togeth...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HARK SHIN SEUNG, HO KIM YONG
Format: Patent
Sprache:eng
Schlagworte:
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