Film carrier tape for mounting electronic devices thereon and method of manufacturing the same

The invention provides a film carrier tape for mounting electronic devices thereon, which film carrier tape enables reliable formation of a predetermined wiring pattern in a pattern-forming region and lower production cost. The film carrier tape of the present invention for mounting electronic devic...

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creator KOYANAGI AKIRA
description The invention provides a film carrier tape for mounting electronic devices thereon, which film carrier tape enables reliable formation of a predetermined wiring pattern in a pattern-forming region and lower production cost. The film carrier tape of the present invention for mounting electronic devices thereon, including an insulating film serving as a tape substrate, and a wiring pattern formed of a conductor layer provided on a surface of the insulating film, the insulating film having a plurality of sprocket holes provided along respective side of longitudinal edges of the wiring pattern, wherein the shortest distance between said sprocket holes and corresponding edges of said wiring pattern is less than 0.7 mm. Thus, production cost of the film carrier tape can be reduced. The invention also provides a method of manufacturing the film carrier tape.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6744123B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6744123B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6744123B23</originalsourceid><addsrcrecordid>eNqNyzEOwjAMRuEuDAi4gy_AQFvBDqJiB1YqK_1DIzVx5LicH5A4ANNbvresHl2YIjlWDVAyziAvSlHmZCE9CROcqaTgaMArOBSyEQpJxGmgCBtlIPEUOc2enc363T6GCkesq4XnqWDz66qi7nw7XbbI0qNkdkiw_n7dH9p2VzfHuvmDvAHOLTxj</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Film carrier tape for mounting electronic devices thereon and method of manufacturing the same</title><source>esp@cenet</source><creator>KOYANAGI AKIRA</creator><creatorcontrib>KOYANAGI AKIRA</creatorcontrib><description>The invention provides a film carrier tape for mounting electronic devices thereon, which film carrier tape enables reliable formation of a predetermined wiring pattern in a pattern-forming region and lower production cost. The film carrier tape of the present invention for mounting electronic devices thereon, including an insulating film serving as a tape substrate, and a wiring pattern formed of a conductor layer provided on a surface of the insulating film, the insulating film having a plurality of sprocket holes provided along respective side of longitudinal edges of the wiring pattern, wherein the shortest distance between said sprocket holes and corresponding edges of said wiring pattern is less than 0.7 mm. Thus, production cost of the film carrier tape can be reduced. The invention also provides a method of manufacturing the film carrier tape.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20040601&amp;DB=EPODOC&amp;CC=US&amp;NR=6744123B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20040601&amp;DB=EPODOC&amp;CC=US&amp;NR=6744123B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOYANAGI AKIRA</creatorcontrib><title>Film carrier tape for mounting electronic devices thereon and method of manufacturing the same</title><description>The invention provides a film carrier tape for mounting electronic devices thereon, which film carrier tape enables reliable formation of a predetermined wiring pattern in a pattern-forming region and lower production cost. The film carrier tape of the present invention for mounting electronic devices thereon, including an insulating film serving as a tape substrate, and a wiring pattern formed of a conductor layer provided on a surface of the insulating film, the insulating film having a plurality of sprocket holes provided along respective side of longitudinal edges of the wiring pattern, wherein the shortest distance between said sprocket holes and corresponding edges of said wiring pattern is less than 0.7 mm. Thus, production cost of the film carrier tape can be reduced. The invention also provides a method of manufacturing the film carrier tape.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyzEOwjAMRuEuDAi4gy_AQFvBDqJiB1YqK_1DIzVx5LicH5A4ANNbvresHl2YIjlWDVAyziAvSlHmZCE9CROcqaTgaMArOBSyEQpJxGmgCBtlIPEUOc2enc363T6GCkesq4XnqWDz66qi7nw7XbbI0qNkdkiw_n7dH9p2VzfHuvmDvAHOLTxj</recordid><startdate>20040601</startdate><enddate>20040601</enddate><creator>KOYANAGI AKIRA</creator><scope>EVB</scope></search><sort><creationdate>20040601</creationdate><title>Film carrier tape for mounting electronic devices thereon and method of manufacturing the same</title><author>KOYANAGI AKIRA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6744123B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KOYANAGI AKIRA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOYANAGI AKIRA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Film carrier tape for mounting electronic devices thereon and method of manufacturing the same</title><date>2004-06-01</date><risdate>2004</risdate><abstract>The invention provides a film carrier tape for mounting electronic devices thereon, which film carrier tape enables reliable formation of a predetermined wiring pattern in a pattern-forming region and lower production cost. The film carrier tape of the present invention for mounting electronic devices thereon, including an insulating film serving as a tape substrate, and a wiring pattern formed of a conductor layer provided on a surface of the insulating film, the insulating film having a plurality of sprocket holes provided along respective side of longitudinal edges of the wiring pattern, wherein the shortest distance between said sprocket holes and corresponding edges of said wiring pattern is less than 0.7 mm. Thus, production cost of the film carrier tape can be reduced. The invention also provides a method of manufacturing the film carrier tape.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title Film carrier tape for mounting electronic devices thereon and method of manufacturing the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T17%3A36%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KOYANAGI%20AKIRA&rft.date=2004-06-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS6744123B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true