Adhesiveless transfer lamination method and materials for producing electronic circuits

An electronic circuit is made by printing a Parmod(R) composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configurat...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KYDD PAUL H
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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