Wafer fabrication for thermal pole tip expansion/recession compensation
The slider and method of the present invention relate to a slider for a disc drive. The slider includes a substrate having a cavity and a filler within the cavity. The slider further includes a transducer that is positioned near the filler. The design facilitates controlling the relative thermal exp...
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creator | STOVER LANCE EUGENE GATES JANE KATHERINE BOUTAGHOU ZINE EDDINE MEI YOUPING PETERSON JAMES RICHARD RIDDERING JASON WAYNE BONIN WAYNE ALLEN |
description | The slider and method of the present invention relate to a slider for a disc drive. The slider includes a substrate having a cavity and a filler within the cavity. The slider further includes a transducer that is positioned near the filler. The design facilitates controlling the relative thermal expansion between the transducer and substrate of the slider that is near the transducer. Compensating for the thermal expansion of the transducer provides a more consistent fly height of the slider during operation of the disc drive. In addition, the design adjusts the air-bearing surface of the slider such that the transducer does not extend below the rest of the slider as the transducer expands. |
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The slider includes a substrate having a cavity and a filler within the cavity. The slider further includes a transducer that is positioned near the filler. The design facilitates controlling the relative thermal expansion between the transducer and substrate of the slider that is near the transducer. Compensating for the thermal expansion of the transducer provides a more consistent fly height of the slider during operation of the disc drive. In addition, the design adjusts the air-bearing surface of the slider such that the transducer does not extend below the rest of the slider as the transducer expands.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER PHYSICS |
title | Wafer fabrication for thermal pole tip expansion/recession compensation |
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