Semiconductor element test apparatus, and method of testing semiconductor element using the apparatus

In a semiconductor element test apparatus and a method of testing a semiconductor element using the apparatus, a plurality of probe needles are brought into contact with semiconductor elements fabricated on a semiconductor wafer, and a structure is provided for attaching a probe card and a reinforce...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: MIKI KAZUNOBU
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator MIKI KAZUNOBU
description In a semiconductor element test apparatus and a method of testing a semiconductor element using the apparatus, a plurality of probe needles are brought into contact with semiconductor elements fabricated on a semiconductor wafer, and a structure is provided for attaching a probe card and a reinforcement member to a probe card hold member. In a plurality of mount positions in which a probe card substrate and a reinforcement member are attached to a probe card hold member, counterbores are formed so as to assume substantially the same depth and shape. Analogous mount structures are realized at a plurality of mount positions by way of the counterbores.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6710615B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6710615B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6710615B23</originalsourceid><addsrcrecordid>eNrjZEgNTs3NTM7PSylNLskvUkjNSc1NzStRKEktLlFILChILEosKS3WUUjMS1HITS3JyE9RyE8Dy2bmpSsUY9VbWgySK8lIRRjAw8CalphTnMoLpbkZFNxcQ5w9dFML8uNTiwsSk1PzUkviQ4PNzA0NzAxNnYyMiVACABxmP8A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor element test apparatus, and method of testing semiconductor element using the apparatus</title><source>esp@cenet</source><creator>MIKI KAZUNOBU</creator><creatorcontrib>MIKI KAZUNOBU</creatorcontrib><description>In a semiconductor element test apparatus and a method of testing a semiconductor element using the apparatus, a plurality of probe needles are brought into contact with semiconductor elements fabricated on a semiconductor wafer, and a structure is provided for attaching a probe card and a reinforcement member to a probe card hold member. In a plurality of mount positions in which a probe card substrate and a reinforcement member are attached to a probe card hold member, counterbores are formed so as to assume substantially the same depth and shape. Analogous mount structures are realized at a plurality of mount positions by way of the counterbores.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20040323&amp;DB=EPODOC&amp;CC=US&amp;NR=6710615B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20040323&amp;DB=EPODOC&amp;CC=US&amp;NR=6710615B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIKI KAZUNOBU</creatorcontrib><title>Semiconductor element test apparatus, and method of testing semiconductor element using the apparatus</title><description>In a semiconductor element test apparatus and a method of testing a semiconductor element using the apparatus, a plurality of probe needles are brought into contact with semiconductor elements fabricated on a semiconductor wafer, and a structure is provided for attaching a probe card and a reinforcement member to a probe card hold member. In a plurality of mount positions in which a probe card substrate and a reinforcement member are attached to a probe card hold member, counterbores are formed so as to assume substantially the same depth and shape. Analogous mount structures are realized at a plurality of mount positions by way of the counterbores.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEgNTs3NTM7PSylNLskvUkjNSc1NzStRKEktLlFILChILEosKS3WUUjMS1HITS3JyE9RyE8Dy2bmpSsUY9VbWgySK8lIRRjAw8CalphTnMoLpbkZFNxcQ5w9dFML8uNTiwsSk1PzUkviQ4PNzA0NzAxNnYyMiVACABxmP8A</recordid><startdate>20040323</startdate><enddate>20040323</enddate><creator>MIKI KAZUNOBU</creator><scope>EVB</scope></search><sort><creationdate>20040323</creationdate><title>Semiconductor element test apparatus, and method of testing semiconductor element using the apparatus</title><author>MIKI KAZUNOBU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6710615B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MIKI KAZUNOBU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIKI KAZUNOBU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor element test apparatus, and method of testing semiconductor element using the apparatus</title><date>2004-03-23</date><risdate>2004</risdate><abstract>In a semiconductor element test apparatus and a method of testing a semiconductor element using the apparatus, a plurality of probe needles are brought into contact with semiconductor elements fabricated on a semiconductor wafer, and a structure is provided for attaching a probe card and a reinforcement member to a probe card hold member. In a plurality of mount positions in which a probe card substrate and a reinforcement member are attached to a probe card hold member, counterbores are formed so as to assume substantially the same depth and shape. Analogous mount structures are realized at a plurality of mount positions by way of the counterbores.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US6710615B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title Semiconductor element test apparatus, and method of testing semiconductor element using the apparatus
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T16%3A54%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MIKI%20KAZUNOBU&rft.date=2004-03-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS6710615B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true