Method of simultaneously polishing a plurality of objects of a similar type, in particular silicon wafers, on a polishing installation
The method allows simultaneous polishing of a plurality of objects of a similar type, preferably silicon wafers. The polishing process is interrupted briefly at least once. During the polishing pause, the carriers on which the objects to be polished have been mounted are rotated onward sequentially...
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| creator | LAHNOR PETER |
| description | The method allows simultaneous polishing of a plurality of objects of a similar type, preferably silicon wafers. The polishing process is interrupted briefly at least once. During the polishing pause, the carriers on which the objects to be polished have been mounted are rotated onward sequentially and then the polishing operation is continued. The objects are mounted on one or more carriers which are at a free position during the polishing operation. This has the advantage that the polishing operation does not have to be additionally interrupted for the purpose of loading and unloading the carrier. This saves valuable machine time, so that the throughput is increased. At the same time, the fact that each wafer is processed at a plurality of polishing plates stabilizes the result of polishing, since the individual abrasion properties of the individual polishing plates are averaged out. |
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The polishing process is interrupted briefly at least once. During the polishing pause, the carriers on which the objects to be polished have been mounted are rotated onward sequentially and then the polishing operation is continued. The objects are mounted on one or more carriers which are at a free position during the polishing operation. This has the advantage that the polishing operation does not have to be additionally interrupted for the purpose of loading and unloading the carrier. This saves valuable machine time, so that the throughput is increased. 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The polishing process is interrupted briefly at least once. During the polishing pause, the carriers on which the objects to be polished have been mounted are rotated onward sequentially and then the polishing operation is continued. The objects are mounted on one or more carriers which are at a free position during the polishing operation. This has the advantage that the polishing operation does not have to be additionally interrupted for the purpose of loading and unloading the carrier. This saves valuable machine time, so that the throughput is increased. At the same time, the fact that each wafer is processed at a plurality of polishing plates stabilizes the result of polishing, since the individual abrasion properties of the individual polishing plates are averaged out.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Method of simultaneously polishing a plurality of objects of a similar type, in particular silicon wafers, on a polishing installation |
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