Reinforced aluminum copper bonding pad

A method of forming a bond pad structure reinforced with insulator spacers located on the sides of the bond pad structure has been developed. The method features formation of an aluminum based bond pad structure located overlying and contacting a top portion of a metal interconnect structure exposed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG CHENGUNG, HSU HUAI-JEN, CHANG WEN-TSAN, SU YEA-ZAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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