Wet injecting fine abrasives for water jet curved cutting of very brittle materials

The present invention relates to methods and systems for isolating non-rectangular shaped optical integrated circuits formed on a brittle substrate. For example, a brittle substrate comprising a plurality of non-rectangular shaped optical integrated circuits is provided on a water jet cutting system...

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Bibliographische Detailangaben
Hauptverfasser:	QUIRKE DAVID J, COLE ROBERT
Format:	Patent
Sprache:	eng
Schlagworte:	ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GRINDING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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