Thermal mismatch compensation technique for integrated circuit assemblies

Techniques for minimizing stress induced by temperature changes in an integrated circuit (e.g., focal plane array or processor) or other such assemblies that include materials having mismatched coefficients of thermal expansion/contraction are disclosed. A thermal interface including a flexible comb...

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Bibliographische Detailangaben
Hauptverfasser:	ROURKE PAUL H, HOLLAND RICHARD S, MULLARKEY JOHN D, ROBILLARD GENE A, GRANEY ROBERT N, MARCINIEC JOHN W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING COLD ROOMS COLORIMETRY COMBINED HEATING AND REFRIGERATION SYSTEMS COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT PUMP SYSTEMS HEATING ICE-BOXES LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING MECHANICAL ENGINEERING PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION RADIATION PYROMETRY REFRIGERATION OR COOLING REFRIGERATORS SEMICONDUCTOR DEVICES TESTING WEAPONS
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Beschreibung
Zusammenfassung:	Techniques for minimizing stress induced by temperature changes in an integrated circuit (e.g., focal plane array or processor) or other such assemblies that include materials having mismatched coefficients of thermal expansion/contraction are disclosed. A thermal interface including a flexible comb-like pattern enables compensation for mismatched coefficients thereby reducing thermal-related stress.