Semiconductor device having a built-in contact-type sensor and manufacturing method thereof
In a semiconductor device having a built-in contact-type sensor, a height of a surrounding part of a sensor part from the exposed surface of the sensor part is reduced. The semiconductor device has a semiconductor element having a built-in sensor. The semiconductor element has a circuit forming surf...
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creator | SAKODA HIDEHARU TANIGUCHI FUMIHIKO |
description | In a semiconductor device having a built-in contact-type sensor, a height of a surrounding part of a sensor part from the exposed surface of the sensor part is reduced. The semiconductor device has a semiconductor element having a built-in sensor. The semiconductor element has a circuit forming surface and a back surface opposite to the circuit forming surface. The contact-type sensor and electrodes are formed on the circuit forming surface. Back electrodes are formed on the back surface. Conductive members extend through the semiconductor device from the electrodes to the back electrodes. A protective film covers the circuit forming surface in a state where the surface of the contact-type sensor is exposed. External connection terminals are electrically connected to the back electrodes. |
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The semiconductor device has a semiconductor element having a built-in sensor. The semiconductor element has a circuit forming surface and a back surface opposite to the circuit forming surface. The contact-type sensor and electrodes are formed on the circuit forming surface. Back electrodes are formed on the back surface. Conductive members extend through the semiconductor device from the electrodes to the back electrodes. A protective film covers the circuit forming surface in a state where the surface of the contact-type sensor is exposed. 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The semiconductor device has a semiconductor element having a built-in sensor. The semiconductor element has a circuit forming surface and a back surface opposite to the circuit forming surface. The contact-type sensor and electrodes are formed on the circuit forming surface. Back electrodes are formed on the back surface. Conductive members extend through the semiconductor device from the electrodes to the back electrodes. A protective film covers the circuit forming surface in a state where the surface of the contact-type sensor is exposed. 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The semiconductor device has a semiconductor element having a built-in sensor. The semiconductor element has a circuit forming surface and a back surface opposite to the circuit forming surface. The contact-type sensor and electrodes are formed on the circuit forming surface. Back electrodes are formed on the back surface. Conductive members extend through the semiconductor device from the electrodes to the back electrodes. A protective film covers the circuit forming surface in a state where the surface of the contact-type sensor is exposed. External connection terminals are electrically connected to the back electrodes.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING DIAGNOSIS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS HUMAN NECESSITIES HYGIENE IDENTIFICATION MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MEDICAL OR VETERINARY SCIENCE PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES SURGERY TESTING |
title | Semiconductor device having a built-in contact-type sensor and manufacturing method thereof |
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