Method for fabricating connectors for interconnecting etched tri-metal circuit structures

In conventional ETM circuit structures a pin connector in which the pin is etched from the ETM substrate and the mating cavity is etched from the ETM substrate to be mated. The connector utilizes the subtractive ETM structure processing to define any one of several pin-cavity configurations. The pin...

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Bibliographische Detailangaben

Hauptverfasser:	KRAUTHEIM THOMAS B, PARUCHURI MOHAN R, GOENKA LAKHI NANDLAL
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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