Manufacturing method for attaching components to a substrate
A method for manufacturing a chip assembly includes the steps of applying a controlled amount of flux to a plurality of solder balls on a die, applying a non-fluxing underfill material to a substrate, and assembling the die and substrate together to form the chip assembly such that the non-fluxing u...
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| creator | PATTERSON TIMOTHY HOCK ALEX LIM TIANG |
| description | A method for manufacturing a chip assembly includes the steps of applying a controlled amount of flux to a plurality of solder balls on a die, applying a non-fluxing underfill material to a substrate, and assembling the die and substrate together to form the chip assembly such that the non-fluxing underfill material is trapped in between the die and the substrate. By applying the underfill material to the substrate before the chip is assembled rather than afterward, the inventive method increases chip assembly speed while maintaining control over flux application to prevent the solder balls from collapsing, eliminate the need for a defined solder resist window, and maintain a consistent die-to-substrate clearance at the solder joint. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6648213B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6648213B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6648213B13</originalsourceid><addsrcrecordid>eNrjZLDxTcwrTUtMLiktysxLV8hNLcnIT1FIyy9SSCwpSUzOAAkm5-cW5Oel5pUUK5TkKyQqFJcmFZcUJZak8jCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSS-NBgMzMTCyNDYydDYyKUAADGMzAF</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Manufacturing method for attaching components to a substrate</title><source>esp@cenet</source><creator>PATTERSON TIMOTHY ; HOCK ALEX LIM TIANG</creator><creatorcontrib>PATTERSON TIMOTHY ; HOCK ALEX LIM TIANG</creatorcontrib><description>A method for manufacturing a chip assembly includes the steps of applying a controlled amount of flux to a plurality of solder balls on a die, applying a non-fluxing underfill material to a substrate, and assembling the die and substrate together to form the chip assembly such that the non-fluxing underfill material is trapped in between the die and the substrate. By applying the underfill material to the substrate before the chip is assembled rather than afterward, the inventive method increases chip assembly speed while maintaining control over flux application to prevent the solder balls from collapsing, eliminate the need for a defined solder resist window, and maintain a consistent die-to-substrate clearance at the solder joint.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20031118&DB=EPODOC&CC=US&NR=6648213B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20031118&DB=EPODOC&CC=US&NR=6648213B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PATTERSON TIMOTHY</creatorcontrib><creatorcontrib>HOCK ALEX LIM TIANG</creatorcontrib><title>Manufacturing method for attaching components to a substrate</title><description>A method for manufacturing a chip assembly includes the steps of applying a controlled amount of flux to a plurality of solder balls on a die, applying a non-fluxing underfill material to a substrate, and assembling the die and substrate together to form the chip assembly such that the non-fluxing underfill material is trapped in between the die and the substrate. By applying the underfill material to the substrate before the chip is assembled rather than afterward, the inventive method increases chip assembly speed while maintaining control over flux application to prevent the solder balls from collapsing, eliminate the need for a defined solder resist window, and maintain a consistent die-to-substrate clearance at the solder joint.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDxTcwrTUtMLiktysxLV8hNLcnIT1FIyy9SSCwpSUzOAAkm5-cW5Oel5pUUK5TkKyQqFJcmFZcUJZak8jCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSS-NBgMzMTCyNDYydDYyKUAADGMzAF</recordid><startdate>20031118</startdate><enddate>20031118</enddate><creator>PATTERSON TIMOTHY</creator><creator>HOCK ALEX LIM TIANG</creator><scope>EVB</scope></search><sort><creationdate>20031118</creationdate><title>Manufacturing method for attaching components to a substrate</title><author>PATTERSON TIMOTHY ; HOCK ALEX LIM TIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6648213B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>PATTERSON TIMOTHY</creatorcontrib><creatorcontrib>HOCK ALEX LIM TIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PATTERSON TIMOTHY</au><au>HOCK ALEX LIM TIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Manufacturing method for attaching components to a substrate</title><date>2003-11-18</date><risdate>2003</risdate><abstract>A method for manufacturing a chip assembly includes the steps of applying a controlled amount of flux to a plurality of solder balls on a die, applying a non-fluxing underfill material to a substrate, and assembling the die and substrate together to form the chip assembly such that the non-fluxing underfill material is trapped in between the die and the substrate. By applying the underfill material to the substrate before the chip is assembled rather than afterward, the inventive method increases chip assembly speed while maintaining control over flux application to prevent the solder balls from collapsing, eliminate the need for a defined solder resist window, and maintain a consistent die-to-substrate clearance at the solder joint.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Manufacturing method for attaching components to a substrate |
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