Hot plate and semiconductor device manufacturing method using the same
An electrostatic chuck type of hot plate is disclosed which permits the temperature of a semiconductor substrate to be measured with good repeatability. In addition to an electrostatic chuck electrode and a heating electrode as provided in conventional hot plates, the inventive hot plate is further...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KATATA TOMIO HAYASAKA NOBUO OKUMURA KATSUYA |
| description | An electrostatic chuck type of hot plate is disclosed which permits the temperature of a semiconductor substrate to be measured with good repeatability. In addition to an electrostatic chuck electrode and a heating electrode as provided in conventional hot plates, the inventive hot plate is further provided with two or more temperature measuring probes. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6566632B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6566632B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6566632B13</originalsourceid><addsrcrecordid>eNqNyk0KwjAQhuFsXIh6h7mACy3mAEpL97brMky-2kDzQzPx_CJ4AFcvD7x70_VJKa-sII6OCoKXFF0VTRs5vL2AAsc6s2jdfHxRgC7JUS1f6AIqHHA0u5nXgtOvB0NdOzz6M3KaUDILInQan_ZmrW2u90vzx_IB4B8zhg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Hot plate and semiconductor device manufacturing method using the same</title><source>esp@cenet</source><creator>KATATA TOMIO ; HAYASAKA NOBUO ; OKUMURA KATSUYA</creator><creatorcontrib>KATATA TOMIO ; HAYASAKA NOBUO ; OKUMURA KATSUYA</creatorcontrib><description>An electrostatic chuck type of hot plate is disclosed which permits the temperature of a semiconductor substrate to be measured with good repeatability. In addition to an electrostatic chuck electrode and a heating electrode as provided in conventional hot plates, the inventive hot plate is further provided with two or more temperature measuring probes.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030520&DB=EPODOC&CC=US&NR=6566632B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030520&DB=EPODOC&CC=US&NR=6566632B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KATATA TOMIO</creatorcontrib><creatorcontrib>HAYASAKA NOBUO</creatorcontrib><creatorcontrib>OKUMURA KATSUYA</creatorcontrib><title>Hot plate and semiconductor device manufacturing method using the same</title><description>An electrostatic chuck type of hot plate is disclosed which permits the temperature of a semiconductor substrate to be measured with good repeatability. In addition to an electrostatic chuck electrode and a heating electrode as provided in conventional hot plates, the inventive hot plate is further provided with two or more temperature measuring probes.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyk0KwjAQhuFsXIh6h7mACy3mAEpL97brMky-2kDzQzPx_CJ4AFcvD7x70_VJKa-sII6OCoKXFF0VTRs5vL2AAsc6s2jdfHxRgC7JUS1f6AIqHHA0u5nXgtOvB0NdOzz6M3KaUDILInQan_ZmrW2u90vzx_IB4B8zhg</recordid><startdate>20030520</startdate><enddate>20030520</enddate><creator>KATATA TOMIO</creator><creator>HAYASAKA NOBUO</creator><creator>OKUMURA KATSUYA</creator><scope>EVB</scope></search><sort><creationdate>20030520</creationdate><title>Hot plate and semiconductor device manufacturing method using the same</title><author>KATATA TOMIO ; HAYASAKA NOBUO ; OKUMURA KATSUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6566632B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KATATA TOMIO</creatorcontrib><creatorcontrib>HAYASAKA NOBUO</creatorcontrib><creatorcontrib>OKUMURA KATSUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KATATA TOMIO</au><au>HAYASAKA NOBUO</au><au>OKUMURA KATSUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Hot plate and semiconductor device manufacturing method using the same</title><date>2003-05-20</date><risdate>2003</risdate><abstract>An electrostatic chuck type of hot plate is disclosed which permits the temperature of a semiconductor substrate to be measured with good repeatability. In addition to an electrostatic chuck electrode and a heating electrode as provided in conventional hot plates, the inventive hot plate is further provided with two or more temperature measuring probes.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US6566632B1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Hot plate and semiconductor device manufacturing method using the same |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T20%3A46%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KATATA%20TOMIO&rft.date=2003-05-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS6566632B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |