Method for producing circuit board assemblies using surface mount components with finely spaced leads

Method for producing circuit board assemblies using surface mount components with finely spaced leads

Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MA BAO-TONG, SARKHEL AMIT KUMAR, SETO PING KWONG
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator MA BAO-TONG
SARKHEL AMIT KUMAR
SETO PING KWONG
description Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6545229B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6545229B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6545229B13</originalsourceid><addsrcrecordid>eNqNyjsOwjAQRdE0FAjYw9sABYEg0YJANFRAHTn2OLHkeCyPLcTu-YgFUN3inmlFF8oDG1hOiIlN0S700C7p4jI6VslAidDYeUeCIp8tJVmlCSOXkKF5jBwoZMHD5QHWBfJPSHwTA0_KyLyaWOWFFr_OKpyOt8N5SZFb-spAub1ft82mqevdfrX-g7wAAq4_mA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for producing circuit board assemblies using surface mount components with finely spaced leads</title><source>esp@cenet</source><creator>MA BAO-TONG ; SARKHEL AMIT KUMAR ; SETO PING KWONG</creator><creatorcontrib>MA BAO-TONG ; SARKHEL AMIT KUMAR ; SETO PING KWONG</creatorcontrib><description>Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20030408&amp;DB=EPODOC&amp;CC=US&amp;NR=6545229B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20030408&amp;DB=EPODOC&amp;CC=US&amp;NR=6545229B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MA BAO-TONG</creatorcontrib><creatorcontrib>SARKHEL AMIT KUMAR</creatorcontrib><creatorcontrib>SETO PING KWONG</creatorcontrib><title>Method for producing circuit board assemblies using surface mount components with finely spaced leads</title><description>Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjsOwjAQRdE0FAjYw9sABYEg0YJANFRAHTn2OLHkeCyPLcTu-YgFUN3inmlFF8oDG1hOiIlN0S700C7p4jI6VslAidDYeUeCIp8tJVmlCSOXkKF5jBwoZMHD5QHWBfJPSHwTA0_KyLyaWOWFFr_OKpyOt8N5SZFb-spAub1ft82mqevdfrX-g7wAAq4_mA</recordid><startdate>20030408</startdate><enddate>20030408</enddate><creator>MA BAO-TONG</creator><creator>SARKHEL AMIT KUMAR</creator><creator>SETO PING KWONG</creator><scope>EVB</scope></search><sort><creationdate>20030408</creationdate><title>Method for producing circuit board assemblies using surface mount components with finely spaced leads</title><author>MA BAO-TONG ; SARKHEL AMIT KUMAR ; SETO PING KWONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6545229B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MA BAO-TONG</creatorcontrib><creatorcontrib>SARKHEL AMIT KUMAR</creatorcontrib><creatorcontrib>SETO PING KWONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MA BAO-TONG</au><au>SARKHEL AMIT KUMAR</au><au>SETO PING KWONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for producing circuit board assemblies using surface mount components with finely spaced leads</title><date>2003-04-08</date><risdate>2003</risdate><abstract>Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US6545229B1
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Method for producing circuit board assemblies using surface mount components with finely spaced leads
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-01T13%3A28%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MA%20BAO-TONG&rft.date=2003-04-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS6545229B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true