Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit
An integrated circuit (IC) includes a package-integrated Faraday cage assembly to reduce the level of electromagnetic radiation emanating from the IC during operation. The IC uses a number of appropriately spaced leads on the IC package to form part of a Faraday cage surrounding a semiconductor chip...
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| creator | CALVIN SAM E SKINNER HARRY G |
| description | An integrated circuit (IC) includes a package-integrated Faraday cage assembly to reduce the level of electromagnetic radiation emanating from the IC during operation. The IC uses a number of appropriately spaced leads on the IC package to form part of a Faraday cage surrounding a semiconductor chip within the IC. In one approach, the selected leads are coupled by a conductive member to a conductive cover plate of the IC package that forms an upper boundary of the Faraday cage. When the IC is installed in an external circuit, some or all of the selected leads are coupled together outside of the IC package (e.g., to an electrical ground) to form the lower boundary of the Faraday cage. |
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The IC uses a number of appropriately spaced leads on the IC package to form part of a Faraday cage surrounding a semiconductor chip within the IC. In one approach, the selected leads are coupled by a conductive member to a conductive cover plate of the IC package that forms an upper boundary of the Faraday cage. When the IC is installed in an external circuit, some or all of the selected leads are coupled together outside of the IC package (e.g., to an electrical ground) to form the lower boundary of the Faraday cage.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030204&DB=EPODOC&CC=US&NR=6515870B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030204&DB=EPODOC&CC=US&NR=6515870B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CALVIN SAM E</creatorcontrib><creatorcontrib>SKINNER HARRY G</creatorcontrib><title>Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit</title><description>An integrated circuit (IC) includes a package-integrated Faraday cage assembly to reduce the level of electromagnetic radiation emanating from the IC during operation. The IC uses a number of appropriately spaced leads on the IC package to form part of a Faraday cage surrounding a semiconductor chip within the IC. In one approach, the selected leads are coupled by a conductive member to a conductive cover plate of the IC package that forms an upper boundary of the Faraday cage. When the IC is installed in an external circuit, some or all of the selected leads are coupled together outside of the IC package (e.g., to an electrical ground) to form the lower boundary of the Faraday cage.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKAjEQBdNYiPoP-wOCh5xaK4qloLYey-YlBO-SI9kr_HtPsLC0GhiGmZrHheXJHhSiwmdWWHKc2fKL5OM1UYYdBIQWojl17CM0CKELpYQUC7nREsffh4QsQ9C5mThuCxZfzgydjrfDeYk-NSg9C8ZZc79u6qrebVf7av1H8gbqjjy4</recordid><startdate>20030204</startdate><enddate>20030204</enddate><creator>CALVIN SAM E</creator><creator>SKINNER HARRY G</creator><scope>EVB</scope></search><sort><creationdate>20030204</creationdate><title>Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit</title><author>CALVIN SAM E ; SKINNER HARRY G</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6515870B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CALVIN SAM E</creatorcontrib><creatorcontrib>SKINNER HARRY G</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CALVIN SAM E</au><au>SKINNER HARRY G</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit</title><date>2003-02-04</date><risdate>2003</risdate><abstract>An integrated circuit (IC) includes a package-integrated Faraday cage assembly to reduce the level of electromagnetic radiation emanating from the IC during operation. The IC uses a number of appropriately spaced leads on the IC package to form part of a Faraday cage surrounding a semiconductor chip within the IC. In one approach, the selected leads are coupled by a conductive member to a conductive cover plate of the IC package that forms an upper boundary of the Faraday cage. When the IC is installed in an external circuit, some or all of the selected leads are coupled together outside of the IC package (e.g., to an electrical ground) to form the lower boundary of the Faraday cage.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit |
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