Chip element holder and method of handling chip elements

Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing force provided by a pusher member can be appli...

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Hauptverfasser:	SAKAI SATOKI, TODOROKI JIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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creator	SAKAI SATOKI TODOROKI JIRO
description	Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing force provided by a pusher member can be applied through the through holes to the electronic element main bodies bonded on an adhesive surface of the first holder. Meanwhile, the first holder is separated from the electronic element main bodies which are at the same time bonded on to an adhesive surface of the second holder.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6503356B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6503356B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6503356B13</originalsourceid><addsrcrecordid>eNrjZLBwzsgsUEjNSc1NzStRyMjPSUktUkjMS1HITS3JyE9RyE9TyAByczLz0hWSkZQW8zCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSS-NBgM1MDY2NTMydDYyKUAAB9ai2i</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Chip element holder and method of handling chip elements</title><source>esp@cenet</source><creator>SAKAI SATOKI ; TODOROKI JIRO</creator><creatorcontrib>SAKAI SATOKI ; TODOROKI JIRO</creatorcontrib><description>Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing force provided by a pusher member can be applied through the through holes to the electronic element main bodies bonded on an adhesive surface of the first holder. Meanwhile, the first holder is separated from the electronic element main bodies which are at the same time bonded on to an adhesive surface of the second holder.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030107&DB=EPODOC&CC=US&NR=6503356B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030107&DB=EPODOC&CC=US&NR=6503356B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKAI SATOKI</creatorcontrib><creatorcontrib>TODOROKI JIRO</creatorcontrib><title>Chip element holder and method of handling chip elements</title><description>Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing force provided by a pusher member can be applied through the through holes to the electronic element main bodies bonded on an adhesive surface of the first holder. Meanwhile, the first holder is separated from the electronic element main bodies which are at the same time bonded on to an adhesive surface of the second holder.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBwzsgsUEjNSc1NzStRyMjPSUktUkjMS1HITS3JyE9RyE9TyAByczLz0hWSkZQW8zCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSS-NBgM1MDY2NTMydDYyKUAAB9ai2i</recordid><startdate>20030107</startdate><enddate>20030107</enddate><creator>SAKAI SATOKI</creator><creator>TODOROKI JIRO</creator><scope>EVB</scope></search><sort><creationdate>20030107</creationdate><title>Chip element holder and method of handling chip elements</title><author>SAKAI SATOKI ; TODOROKI JIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6503356B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKAI SATOKI</creatorcontrib><creatorcontrib>TODOROKI JIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKAI SATOKI</au><au>TODOROKI JIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip element holder and method of handling chip elements</title><date>2003-01-07</date><risdate>2003</risdate><abstract>Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing force provided by a pusher member can be applied through the through holes to the electronic element main bodies bonded on an adhesive surface of the first holder. Meanwhile, the first holder is separated from the electronic element main bodies which are at the same time bonded on to an adhesive surface of the second holder.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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language	eng
recordid	cdi_epo_espacenet_US6503356B1
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
title	Chip element holder and method of handling chip elements
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T11%3A32%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SAKAI%20SATOKI&rft.date=2003-01-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS6503356B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true