Clear adhesive sheet
A radiation detackifiable adhesive composition comprising a (meth)acrylate copolymer including from about 85 wt. % to about 97.5 wt. % of a (meth)acrylate ester and from about 2.5 wt. % to about 15 wt. % of a copolymerizable carboxylate monomer and a multi-functional urethane acrylate oligomer combi...
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| creator | KANTNER STEVEN S ALAHAPPERUMA KARUNASENA A |
| description | A radiation detackifiable adhesive composition comprising a (meth)acrylate copolymer including from about 85 wt. % to about 97.5 wt. % of a (meth)acrylate ester and from about 2.5 wt. % to about 15 wt. % of a copolymerizable carboxylate monomer and a multi-functional urethane acrylate oligomer combined with the (meth)acrylate copolymer to provide from about 25 parts to about 40 parts of the oligomer per 100 parts of the copolymer. The adhesive composition becomes progressively detackified during exposure to ultraviolet radiation.The present invention further provides a clear adhesive coated sheet for supporting a silicon wafer during manufacture of semiconductor microchips. The coated sheet comprises a transparent film substrate coated with a radiation detackifiable adhesive composition. |
| format | Patent |
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The adhesive composition becomes progressively detackified during exposure to ultraviolet radiation.The present invention further provides a clear adhesive coated sheet for supporting a silicon wafer during manufacture of semiconductor microchips. The coated sheet comprises a transparent film substrate coated with a radiation detackifiable adhesive composition.</description><edition>7</edition><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021029&DB=EPODOC&CC=US&NR=6472065B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021029&DB=EPODOC&CC=US&NR=6472065B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANTNER STEVEN S</creatorcontrib><creatorcontrib>ALAHAPPERUMA KARUNASENA A</creatorcontrib><title>Clear adhesive sheet</title><description>A radiation detackifiable adhesive composition comprising a (meth)acrylate copolymer including from about 85 wt. % to about 97.5 wt. % of a (meth)acrylate ester and from about 2.5 wt. % to about 15 wt. % of a copolymerizable carboxylate monomer and a multi-functional urethane acrylate oligomer combined with the (meth)acrylate copolymer to provide from about 25 parts to about 40 parts of the oligomer per 100 parts of the copolymer. The adhesive composition becomes progressively detackified during exposure to ultraviolet radiation.The present invention further provides a clear adhesive coated sheet for supporting a silicon wafer during manufacture of semiconductor microchips. The coated sheet comprises a transparent film substrate coated with a radiation detackifiable adhesive composition.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBxzklNLFJITMlILc4sS1UozkhNLeFhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwWYm5kYGZqZOhsZEKAEA_HAgUA</recordid><startdate>20021029</startdate><enddate>20021029</enddate><creator>KANTNER STEVEN S</creator><creator>ALAHAPPERUMA KARUNASENA A</creator><scope>EVB</scope></search><sort><creationdate>20021029</creationdate><title>Clear adhesive sheet</title><author>KANTNER STEVEN S ; ALAHAPPERUMA KARUNASENA A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6472065B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>KANTNER STEVEN S</creatorcontrib><creatorcontrib>ALAHAPPERUMA KARUNASENA A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANTNER STEVEN S</au><au>ALAHAPPERUMA KARUNASENA A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Clear adhesive sheet</title><date>2002-10-29</date><risdate>2002</risdate><abstract>A radiation detackifiable adhesive composition comprising a (meth)acrylate copolymer including from about 85 wt. % to about 97.5 wt. % of a (meth)acrylate ester and from about 2.5 wt. % to about 15 wt. % of a copolymerizable carboxylate monomer and a multi-functional urethane acrylate oligomer combined with the (meth)acrylate copolymer to provide from about 25 parts to about 40 parts of the oligomer per 100 parts of the copolymer. The adhesive composition becomes progressively detackified during exposure to ultraviolet radiation.The present invention further provides a clear adhesive coated sheet for supporting a silicon wafer during manufacture of semiconductor microchips. The coated sheet comprises a transparent film substrate coated with a radiation detackifiable adhesive composition.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | Clear adhesive sheet |
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