Decoupling capacitor method and structure using metal based carrier

A process for fabricating a structure using a metal carrier and forming a double capacitor structure. The process comprises forming a first via hole through the metal carrier, forming a dielectric layer around the metal carrier and inside the first via hole, forming a second via hole through the die...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FAROOQ MUKTA S, KNICKERBOCKER JOHN U, REDDY SRINIVASA N, FAROOQ SHAJI, RITA ROBERT A
Format: Patent
Sprache:eng
Schlagworte:
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