Method of filling plated through holes

A method for conductively filling a hole or via disposed in an electronic package to provide a structure having a lower coefficient of thermal expansion. After fabricating a through hole or a plated through hole in an electronic package, the hole or via is filled with metal, and the surface of the e...

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Bibliographische Detailangaben
Hauptverfasser:	HOUSER DAVID E, BHATT ANILKUMAR C, WELSH JOHN A
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A method for conductively filling a hole or via disposed in an electronic package to provide a structure having a lower coefficient of thermal expansion. After fabricating a through hole or a plated through hole in an electronic package, the hole or via is filled with metal, and the surface of the electronic package is sealed.