Simultaneous electroplating of both sides of a dual-sided substrate

A method of simultaneously electroplating both sides of a dual-sided circuit board substrate having electrically connected, multi-trace circuit patterns formed on both sides of the substrate, without requiring formation and at least partial removal of electrically conductive tie bars and associated...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NEWMAN ROBERT, FONTECHA EDWIN R, VIVARES VALERIE
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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