Three device DRAM cell with integrated capacitor and local interconnect

A semiconductor integrated circuit memory cell, including at least three transistors and a capacitor to form a DRAM. The memory cell is fabricated on a semiconductor substrate including impurity regions, and using two semiconductor films, with dielectric films between the semiconductor films. The ca...

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Hauptverfasser: MANN RANDY W, OPPOLD JEFFREY H, BRACCHITTA JOHN A
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creator MANN RANDY W
OPPOLD JEFFREY H
BRACCHITTA JOHN A
description A semiconductor integrated circuit memory cell, including at least three transistors and a capacitor to form a DRAM. The memory cell is fabricated on a semiconductor substrate including impurity regions, and using two semiconductor films, with dielectric films between the semiconductor films. The capacitor contains two electrodes. A substrate impurity region forms one of the electrodes; the other electrode is a semiconductor film which connects the gate of one device to an impurity region of another. The method for manufacturing the above-described integrated circuit, which may be used for the manufacture of similar circuits, is also disclosed.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6420746B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6420746B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6420746B13</originalsourceid><addsrcrecordid>eNrjZHAPyShKTVVISS3LTE5VcAly9FVITs3JUSjPLMlQyMwrSU0vSixJTVFITixITM4syS9SSMxLUcjJT07MAUsXJefn5aUml_AwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NRioObUvNSS-NBgMxMjA3MTMydDYyKUAACtETMn</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Three device DRAM cell with integrated capacitor and local interconnect</title><source>esp@cenet</source><creator>MANN RANDY W ; OPPOLD JEFFREY H ; BRACCHITTA JOHN A</creator><creatorcontrib>MANN RANDY W ; OPPOLD JEFFREY H ; BRACCHITTA JOHN A</creatorcontrib><description>A semiconductor integrated circuit memory cell, including at least three transistors and a capacitor to form a DRAM. The memory cell is fabricated on a semiconductor substrate including impurity regions, and using two semiconductor films, with dielectric films between the semiconductor films. The capacitor contains two electrodes. A substrate impurity region forms one of the electrodes; the other electrode is a semiconductor film which connects the gate of one device to an impurity region of another. The method for manufacturing the above-described integrated circuit, which may be used for the manufacture of similar circuits, is also disclosed.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20020716&amp;DB=EPODOC&amp;CC=US&amp;NR=6420746B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20020716&amp;DB=EPODOC&amp;CC=US&amp;NR=6420746B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MANN RANDY W</creatorcontrib><creatorcontrib>OPPOLD JEFFREY H</creatorcontrib><creatorcontrib>BRACCHITTA JOHN A</creatorcontrib><title>Three device DRAM cell with integrated capacitor and local interconnect</title><description>A semiconductor integrated circuit memory cell, including at least three transistors and a capacitor to form a DRAM. The memory cell is fabricated on a semiconductor substrate including impurity regions, and using two semiconductor films, with dielectric films between the semiconductor films. The capacitor contains two electrodes. A substrate impurity region forms one of the electrodes; the other electrode is a semiconductor film which connects the gate of one device to an impurity region of another. The method for manufacturing the above-described integrated circuit, which may be used for the manufacture of similar circuits, is also disclosed.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAPyShKTVVISS3LTE5VcAly9FVITs3JUSjPLMlQyMwrSU0vSixJTVFITixITM4syS9SSMxLUcjJT07MAUsXJefn5aUml_AwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NRioObUvNSS-NBgMxMjA3MTMydDYyKUAACtETMn</recordid><startdate>20020716</startdate><enddate>20020716</enddate><creator>MANN RANDY W</creator><creator>OPPOLD JEFFREY H</creator><creator>BRACCHITTA JOHN A</creator><scope>EVB</scope></search><sort><creationdate>20020716</creationdate><title>Three device DRAM cell with integrated capacitor and local interconnect</title><author>MANN RANDY W ; OPPOLD JEFFREY H ; BRACCHITTA JOHN A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6420746B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MANN RANDY W</creatorcontrib><creatorcontrib>OPPOLD JEFFREY H</creatorcontrib><creatorcontrib>BRACCHITTA JOHN A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MANN RANDY W</au><au>OPPOLD JEFFREY H</au><au>BRACCHITTA JOHN A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Three device DRAM cell with integrated capacitor and local interconnect</title><date>2002-07-16</date><risdate>2002</risdate><abstract>A semiconductor integrated circuit memory cell, including at least three transistors and a capacitor to form a DRAM. The memory cell is fabricated on a semiconductor substrate including impurity regions, and using two semiconductor films, with dielectric films between the semiconductor films. The capacitor contains two electrodes. A substrate impurity region forms one of the electrodes; the other electrode is a semiconductor film which connects the gate of one device to an impurity region of another. The method for manufacturing the above-described integrated circuit, which may be used for the manufacture of similar circuits, is also disclosed.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Three device DRAM cell with integrated capacitor and local interconnect
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-22T14%3A59%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MANN%20RANDY%20W&rft.date=2002-07-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS6420746B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true