Assembly and method for constructing a multi-die integrated circuit

A multi-die integrated circuit (IC) assembly and method for constructing the same are disclosed. Briefly described, the IC assembly can be constructed with a semiconductor die, a layer of die-attach material, and a flip-chip die. The semiconductor die may contain circuit elements disposed across a t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HARPER TIMOTHY V, SLUPE JAMES P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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