Head interconnect circuit with alignment finger

A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads for electrically connecting heads to drive circuitry. A method for connecting a head interconnect circ...

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Hauptverfasser: MOTZKO ANDREW R, FASTNER KENNETH R, MYERS GREGORY P, KORKOWSKI KURT J, HIMES ADAM K
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Sprache:eng
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creator MOTZKO ANDREW R
FASTNER KENNETH R
MYERS GREGORY P
KORKOWSKI KURT J
HIMES ADAM K
description A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads for electrically connecting heads to drive circuitry. A method for connecting a head interconnect circuit to a printed circuit supported on an head actuator including aligning an alignment finger on the lead tip with a printed surface of a drive circuit for soldering leads on the lead tip to solder pads or connectors on the drive circuit.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6399889B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6399889B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6399889B13</originalsourceid><addsrcrecordid>eNrjZND3SE1MUcjMK0ktSs7Py0tNLlFIzixKLs0sUSjPLMlQSMzJTM_LTc0rUUjLzEtPLeJhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwWbGlpYWFpZOhsZEKAEA96wrFQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Head interconnect circuit with alignment finger</title><source>esp@cenet</source><creator>MOTZKO ANDREW R ; FASTNER KENNETH R ; MYERS GREGORY P ; KORKOWSKI KURT J ; HIMES ADAM K</creator><creatorcontrib>MOTZKO ANDREW R ; FASTNER KENNETH R ; MYERS GREGORY P ; KORKOWSKI KURT J ; HIMES ADAM K</creatorcontrib><description>A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads for electrically connecting heads to drive circuitry. A method for connecting a head interconnect circuit to a printed circuit supported on an head actuator including aligning an alignment finger on the lead tip with a printed surface of a drive circuit for soldering leads on the lead tip to solder pads or connectors on the drive circuit.</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INFORMATION STORAGE ; INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20020604&amp;DB=EPODOC&amp;CC=US&amp;NR=6399889B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20020604&amp;DB=EPODOC&amp;CC=US&amp;NR=6399889B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MOTZKO ANDREW R</creatorcontrib><creatorcontrib>FASTNER KENNETH R</creatorcontrib><creatorcontrib>MYERS GREGORY P</creatorcontrib><creatorcontrib>KORKOWSKI KURT J</creatorcontrib><creatorcontrib>HIMES ADAM K</creatorcontrib><title>Head interconnect circuit with alignment finger</title><description>A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads for electrically connecting heads to drive circuitry. A method for connecting a head interconnect circuit to a printed circuit supported on an head actuator including aligning an alignment finger on the lead tip with a printed surface of a drive circuit for soldering leads on the lead tip to solder pads or connectors on the drive circuit.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INFORMATION STORAGE</subject><subject>INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND3SE1MUcjMK0ktSs7Py0tNLlFIzixKLs0sUSjPLMlQSMzJTM_LTc0rUUjLzEtPLeJhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwWbGlpYWFpZOhsZEKAEA96wrFQ</recordid><startdate>20020604</startdate><enddate>20020604</enddate><creator>MOTZKO ANDREW R</creator><creator>FASTNER KENNETH R</creator><creator>MYERS GREGORY P</creator><creator>KORKOWSKI KURT J</creator><creator>HIMES ADAM K</creator><scope>EVB</scope></search><sort><creationdate>20020604</creationdate><title>Head interconnect circuit with alignment finger</title><author>MOTZKO ANDREW R ; FASTNER KENNETH R ; MYERS GREGORY P ; KORKOWSKI KURT J ; HIMES ADAM K</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6399889B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INFORMATION STORAGE</topic><topic>INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MOTZKO ANDREW R</creatorcontrib><creatorcontrib>FASTNER KENNETH R</creatorcontrib><creatorcontrib>MYERS GREGORY P</creatorcontrib><creatorcontrib>KORKOWSKI KURT J</creatorcontrib><creatorcontrib>HIMES ADAM K</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MOTZKO ANDREW R</au><au>FASTNER KENNETH R</au><au>MYERS GREGORY P</au><au>KORKOWSKI KURT J</au><au>HIMES ADAM K</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Head interconnect circuit with alignment finger</title><date>2002-06-04</date><risdate>2002</risdate><abstract>A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads for electrically connecting heads to drive circuitry. A method for connecting a head interconnect circuit to a printed circuit supported on an head actuator including aligning an alignment finger on the lead tip with a printed surface of a drive circuit for soldering leads on the lead tip to solder pads or connectors on the drive circuit.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
title Head interconnect circuit with alignment finger
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T04%3A49%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MOTZKO%20ANDREW%20R&rft.date=2002-06-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS6399889B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true