Airtight sealing method and airtight sealing apparatus for semiconductor laser element
The present invention provides a method for hermetically sealing a semiconductor laser element, by which the cleanness of a package can be maintained extremely satisfactorily in a stabilized state, in order to prevent organic substances from being adhered to the end faces of high output semiconducto...
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| creator | AIKIYO TAKESHI |
| description | The present invention provides a method for hermetically sealing a semiconductor laser element, by which the cleanness of a package can be maintained extremely satisfactorily in a stabilized state, in order to prevent organic substances from being adhered to the end faces of high output semiconductor laser elements due to photochemical actions. The method comprises the first step of introducing oxygen into a chamber of a hermetical-sealing apparatus and irradiating ultraviolet rays onto an unsealed package having a semiconductor laser element mounted, in the chamber, and the second step of purging the chamber with an inert gas and hermetically sealing an unsealed package in the inert gas atmosphere without being exposed to the outer atmosphere. |
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The method comprises the first step of introducing oxygen into a chamber of a hermetical-sealing apparatus and irradiating ultraviolet rays onto an unsealed package having a semiconductor laser element mounted, in the chamber, and the second step of purging the chamber with an inert gas and hermetically sealing an unsealed package in the inert gas atmosphere without being exposed to the outer atmosphere.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020528&DB=EPODOC&CC=US&NR=6396023B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020528&DB=EPODOC&CC=US&NR=6396023B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AIKIYO TAKESHI</creatorcontrib><title>Airtight sealing method and airtight sealing apparatus for semiconductor laser element</title><description>The present invention provides a method for hermetically sealing a semiconductor laser element, by which the cleanness of a package can be maintained extremely satisfactorily in a stabilized state, in order to prevent organic substances from being adhered to the end faces of high output semiconductor laser elements due to photochemical actions. The method comprises the first step of introducing oxygen into a chamber of a hermetical-sealing apparatus and irradiating ultraviolet rays onto an unsealed package having a semiconductor laser element mounted, in the chamber, and the second step of purging the chamber with an inert gas and hermetically sealing an unsealed package in the inert gas atmosphere without being exposed to the outer atmosphere.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhzzCwqyUzPKFEoTk3MycxLV8hNLcnIT1FIzANidLnEgoLEosSS0mKFtPwioGhuZnJ-XkppcgmQl5NYnFqkkJqTmpuaV8LDwJqWmFOcyguluRkU3FxDnD10Uwvy41OLCxKTU_NSS-JDg82MLc0MjIydDI2JUAIA9ns58Q</recordid><startdate>20020528</startdate><enddate>20020528</enddate><creator>AIKIYO TAKESHI</creator><scope>EVB</scope></search><sort><creationdate>20020528</creationdate><title>Airtight sealing method and airtight sealing apparatus for semiconductor laser element</title><author>AIKIYO TAKESHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6396023B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>AIKIYO TAKESHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AIKIYO TAKESHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Airtight sealing method and airtight sealing apparatus for semiconductor laser element</title><date>2002-05-28</date><risdate>2002</risdate><abstract>The present invention provides a method for hermetically sealing a semiconductor laser element, by which the cleanness of a package can be maintained extremely satisfactorily in a stabilized state, in order to prevent organic substances from being adhered to the end faces of high output semiconductor laser elements due to photochemical actions. The method comprises the first step of introducing oxygen into a chamber of a hermetical-sealing apparatus and irradiating ultraviolet rays onto an unsealed package having a semiconductor laser element mounted, in the chamber, and the second step of purging the chamber with an inert gas and hermetically sealing an unsealed package in the inert gas atmosphere without being exposed to the outer atmosphere.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Airtight sealing method and airtight sealing apparatus for semiconductor laser element |
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