Method for adhering and sealing a silicon chip in an integrated circuit package

A method and apparatus for producing an integrated circuit package (30) comprising a substrate (70) having an opening (86) and first and second surfaces (92, 94), a plurality of routing strips (82) being integral with the substrate (70) and extending into the opening (86), a plurality of pads (100)...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YEW CHEE KIANG, ENG KIAN TENG, CHAN BOON PEW, TOH TUCK FOOK, CHAN MIN YU, LOW SIU WAF, GOH JING SUA, YEE PAK HONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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