Surface treatment material deposition and recapture
A method and system for applying a surface treatment to an object. The system comprises: a source chamber (106) for holding a source of surface treatment material (102); a deposition chamber (112) enclosing the object to be treated (104); a recovery chamber (108); a supply of carrier gas (110); cond...
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| creator | ROBBINS ROGER A |
| description | A method and system for applying a surface treatment to an object. The system comprises: a source chamber (106) for holding a source of surface treatment material (102); a deposition chamber (112) enclosing the object to be treated (104); a recovery chamber (108); a supply of carrier gas (110); conduit (116) connecting the source chamber (106) to the deposition chamber (112) and the deposition chamber (112) to the recovery chamber (108) and for controlling the flow of the carrier gas between the source chamber (106), the deposition chamber (112) and the recovery chamber; and a heater (124) for heating the source chamber (106), the source of surface treatment material (102), the deposition chamber (112), an upper portion (120) of the recovery chamber (108), the carrier gas, and the conduit (116). When heated, the source material (102) evaporates into the carrier gas and is carried to the deposition chamber (112) where is attaches to the surface of the object being treated (104). The depleted carrier gas is then delivered to the cooler lower portion (122) of the recovery chamber (108) where it condenses out of the carrier gas. After the supply of material (102) is depleted, the system flow is reversed to reuse the remaining source material (102). Throughout the deposition process, the carrier gas and all system surfaces are held above the condensation point of the source material-laden carrier gas to prevent unwanted deposition of the source material (102). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6365229B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6365229B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6365229B13</originalsourceid><addsrcrecordid>eNrjZDAOLi1KS0xOVSgpSk0syU3NK1HITSxJLcpMzFFISS3IL84syczPU0jMS1EoSk1OLCgpLUrlYWBNS8wpTuWF0twMCm6uIc4eukD18anFBUDj8lJL4kODzYzNTI2MLJ0MjYlQAgDh5Cy0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Surface treatment material deposition and recapture</title><source>esp@cenet</source><creator>ROBBINS ROGER A</creator><creatorcontrib>ROBBINS ROGER A</creatorcontrib><description>A method and system for applying a surface treatment to an object. The system comprises: a source chamber (106) for holding a source of surface treatment material (102); a deposition chamber (112) enclosing the object to be treated (104); a recovery chamber (108); a supply of carrier gas (110); conduit (116) connecting the source chamber (106) to the deposition chamber (112) and the deposition chamber (112) to the recovery chamber (108) and for controlling the flow of the carrier gas between the source chamber (106), the deposition chamber (112) and the recovery chamber; and a heater (124) for heating the source chamber (106), the source of surface treatment material (102), the deposition chamber (112), an upper portion (120) of the recovery chamber (108), the carrier gas, and the conduit (116). When heated, the source material (102) evaporates into the carrier gas and is carried to the deposition chamber (112) where is attaches to the surface of the object being treated (104). The depleted carrier gas is then delivered to the cooler lower portion (122) of the recovery chamber (108) where it condenses out of the carrier gas. After the supply of material (102) is depleted, the system flow is reversed to reuse the remaining source material (102). Throughout the deposition process, the carrier gas and all system surfaces are held above the condensation point of the source material-laden carrier gas to prevent unwanted deposition of the source material (102).</description><edition>7</edition><language>eng</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SPRAYING OR ATOMISING IN GENERAL ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TRANSPORTING</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020402&DB=EPODOC&CC=US&NR=6365229B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020402&DB=EPODOC&CC=US&NR=6365229B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ROBBINS ROGER A</creatorcontrib><title>Surface treatment material deposition and recapture</title><description>A method and system for applying a surface treatment to an object. The system comprises: a source chamber (106) for holding a source of surface treatment material (102); a deposition chamber (112) enclosing the object to be treated (104); a recovery chamber (108); a supply of carrier gas (110); conduit (116) connecting the source chamber (106) to the deposition chamber (112) and the deposition chamber (112) to the recovery chamber (108) and for controlling the flow of the carrier gas between the source chamber (106), the deposition chamber (112) and the recovery chamber; and a heater (124) for heating the source chamber (106), the source of surface treatment material (102), the deposition chamber (112), an upper portion (120) of the recovery chamber (108), the carrier gas, and the conduit (116). When heated, the source material (102) evaporates into the carrier gas and is carried to the deposition chamber (112) where is attaches to the surface of the object being treated (104). The depleted carrier gas is then delivered to the cooler lower portion (122) of the recovery chamber (108) where it condenses out of the carrier gas. After the supply of material (102) is depleted, the system flow is reversed to reuse the remaining source material (102). Throughout the deposition process, the carrier gas and all system surfaces are held above the condensation point of the source material-laden carrier gas to prevent unwanted deposition of the source material (102).</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAOLi1KS0xOVSgpSk0syU3NK1HITSxJLcpMzFFISS3IL84syczPU0jMS1EoSk1OLCgpLUrlYWBNS8wpTuWF0twMCm6uIc4eukD18anFBUDj8lJL4kODzYzNTI2MLJ0MjYlQAgDh5Cy0</recordid><startdate>20020402</startdate><enddate>20020402</enddate><creator>ROBBINS ROGER A</creator><scope>EVB</scope></search><sort><creationdate>20020402</creationdate><title>Surface treatment material deposition and recapture</title><author>ROBBINS ROGER A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6365229B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ROBBINS ROGER A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ROBBINS ROGER A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Surface treatment material deposition and recapture</title><date>2002-04-02</date><risdate>2002</risdate><abstract>A method and system for applying a surface treatment to an object. The system comprises: a source chamber (106) for holding a source of surface treatment material (102); a deposition chamber (112) enclosing the object to be treated (104); a recovery chamber (108); a supply of carrier gas (110); conduit (116) connecting the source chamber (106) to the deposition chamber (112) and the deposition chamber (112) to the recovery chamber (108) and for controlling the flow of the carrier gas between the source chamber (106), the deposition chamber (112) and the recovery chamber; and a heater (124) for heating the source chamber (106), the source of surface treatment material (102), the deposition chamber (112), an upper portion (120) of the recovery chamber (108), the carrier gas, and the conduit (116). When heated, the source material (102) evaporates into the carrier gas and is carried to the deposition chamber (112) where is attaches to the surface of the object being treated (104). The depleted carrier gas is then delivered to the cooler lower portion (122) of the recovery chamber (108) where it condenses out of the carrier gas. After the supply of material (102) is depleted, the system flow is reversed to reuse the remaining source material (102). Throughout the deposition process, the carrier gas and all system surfaces are held above the condensation point of the source material-laden carrier gas to prevent unwanted deposition of the source material (102).</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING |
| title | Surface treatment material deposition and recapture |
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