Method and apparatus for combined particle location and removal

Method and apparatus for combined particle location and removal

A method for removing one or more particles from a surface of an object is provided. The method has first and second steps of detecting and locating the one or more particles on the surface of the object. In a third step, focused energy is directed onto one or more of the detected particles to break...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIM BEN, BRIGANTE JEFFREY A, GALE GLENN W, SYVERSON WILLIAM A, HEVEY MAURICE R, KERN, JR. FREDERICK W, SHARROW JOEL M
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KIM BEN
BRIGANTE JEFFREY A
GALE GLENN W
SYVERSON WILLIAM A
HEVEY MAURICE R
KERN, JR. FREDERICK W
SHARROW JOEL M
description A method for removing one or more particles from a surface of an object is provided. The method has first and second steps of detecting and locating the one or more particles on the surface of the object. In a third step, focused energy is directed onto one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface. In preferred variations of the method of the present invention, the object is a semiconductor wafer and the directed focused energy is in the form of a laser. Also provided is an apparatus for removing the plurality of particles from the surface of the object. The apparatus includes a detector for detecting and locating the plurality of particles on the surface of the object, and a laser for directing focused energy on one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6356653B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6356653B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6356653B23</originalsourceid><addsrcrecordid>eNrjZLD3TS3JyE9RSMwD4oKCxKLEktJihbT8IoXk_NykzLzUFAWgYElmck6qQk5-cmJJZn4eWHFRam5-WWIODwNrWmJOcSovlOZmUHBzDXH20E0tyI9PLS5ITE7NSy2JDw02MzY1MzM1djIyJkIJADSDML8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method and apparatus for combined particle location and removal</title><source>esp@cenet</source><creator>KIM BEN ; BRIGANTE JEFFREY A ; GALE GLENN W ; SYVERSON WILLIAM A ; HEVEY MAURICE R ; KERN, JR. FREDERICK W ; SHARROW JOEL M</creator><creatorcontrib>KIM BEN ; BRIGANTE JEFFREY A ; GALE GLENN W ; SYVERSON WILLIAM A ; HEVEY MAURICE R ; KERN, JR. FREDERICK W ; SHARROW JOEL M</creatorcontrib><description>A method for removing one or more particles from a surface of an object is provided. The method has first and second steps of detecting and locating the one or more particles on the surface of the object. In a third step, focused energy is directed onto one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface. In preferred variations of the method of the present invention, the object is a semiconductor wafer and the directed focused energy is in the form of a laser. Also provided is an apparatus for removing the plurality of particles from the surface of the object. The apparatus includes a detector for detecting and locating the plurality of particles on the surface of the object, and a laser for directing focused energy on one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20020312&amp;DB=EPODOC&amp;CC=US&amp;NR=6356653B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20020312&amp;DB=EPODOC&amp;CC=US&amp;NR=6356653B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM BEN</creatorcontrib><creatorcontrib>BRIGANTE JEFFREY A</creatorcontrib><creatorcontrib>GALE GLENN W</creatorcontrib><creatorcontrib>SYVERSON WILLIAM A</creatorcontrib><creatorcontrib>HEVEY MAURICE R</creatorcontrib><creatorcontrib>KERN, JR. FREDERICK W</creatorcontrib><creatorcontrib>SHARROW JOEL M</creatorcontrib><title>Method and apparatus for combined particle location and removal</title><description>A method for removing one or more particles from a surface of an object is provided. The method has first and second steps of detecting and locating the one or more particles on the surface of the object. In a third step, focused energy is directed onto one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface. In preferred variations of the method of the present invention, the object is a semiconductor wafer and the directed focused energy is in the form of a laser. Also provided is an apparatus for removing the plurality of particles from the surface of the object. The apparatus includes a detector for detecting and locating the plurality of particles on the surface of the object, and a laser for directing focused energy on one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD3TS3JyE9RSMwD4oKCxKLEktJihbT8IoXk_NykzLzUFAWgYElmck6qQk5-cmJJZn4eWHFRam5-WWIODwNrWmJOcSovlOZmUHBzDXH20E0tyI9PLS5ITE7NSy2JDw02MzY1MzM1djIyJkIJADSDML8</recordid><startdate>20020312</startdate><enddate>20020312</enddate><creator>KIM BEN</creator><creator>BRIGANTE JEFFREY A</creator><creator>GALE GLENN W</creator><creator>SYVERSON WILLIAM A</creator><creator>HEVEY MAURICE R</creator><creator>KERN, JR. FREDERICK W</creator><creator>SHARROW JOEL M</creator><scope>EVB</scope></search><sort><creationdate>20020312</creationdate><title>Method and apparatus for combined particle location and removal</title><author>KIM BEN ; BRIGANTE JEFFREY A ; GALE GLENN W ; SYVERSON WILLIAM A ; HEVEY MAURICE R ; KERN, JR. FREDERICK W ; SHARROW JOEL M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6356653B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM BEN</creatorcontrib><creatorcontrib>BRIGANTE JEFFREY A</creatorcontrib><creatorcontrib>GALE GLENN W</creatorcontrib><creatorcontrib>SYVERSON WILLIAM A</creatorcontrib><creatorcontrib>HEVEY MAURICE R</creatorcontrib><creatorcontrib>KERN, JR. FREDERICK W</creatorcontrib><creatorcontrib>SHARROW JOEL M</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM BEN</au><au>BRIGANTE JEFFREY A</au><au>GALE GLENN W</au><au>SYVERSON WILLIAM A</au><au>HEVEY MAURICE R</au><au>KERN, JR. FREDERICK W</au><au>SHARROW JOEL M</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and apparatus for combined particle location and removal</title><date>2002-03-12</date><risdate>2002</risdate><abstract>A method for removing one or more particles from a surface of an object is provided. The method has first and second steps of detecting and locating the one or more particles on the surface of the object. In a third step, focused energy is directed onto one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface. In preferred variations of the method of the present invention, the object is a semiconductor wafer and the directed focused energy is in the form of a laser. Also provided is an apparatus for removing the plurality of particles from the surface of the object. The apparatus includes a detector for detecting and locating the plurality of particles on the surface of the object, and a laser for directing focused energy on one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US6356653B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method and apparatus for combined particle location and removal
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T04%3A36%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIM%20BEN&rft.date=2002-03-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS6356653B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true