Salsa clean process

A wet spray cleaning process for removing thick organic layers including hardened photoresist from the surface of silicon wafers yields low residual particle counts for photoresist thicknesses up to 3 microns, and maintains low residual particle density for oxide-covered wafer regions. The cleaning...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WANG SHU TSAI, BERTRAND JACQUES, OU WEIWEN, CHU YEN C, OKADA LYNNE A, DICK BARRY
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
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