Optical array chip packages with passive alignment features

An adhesive layer is applied to the surface of a flat, transparent flexible circuit that contains electrically conductive traces one, or more, electronic components is secured by the adhesive layer to the flexible circuit. A dam is formed that encircles at least a substantial portion of the componen...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KRYZAK CHARLES J
Format:	Patent
Sprache:	eng
Schlagworte:	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS
Online-Zugang:	Volltext bestellen
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