Electronic package with bonded structure and method of making

Electronic package with bonded structure and method of making

An electronic package comprising a semiconductor chip mounted on a substrate is formed by bonding a structure which covers at least an outer surface of the semiconductor chip and has the same or about the same thermal expansion coefficient as the substrate to the semiconductor chip's side surfa...

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Hauptverfasser: SHISHIDO ITSUROH, MATSUMOTO TOSHIHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SHISHIDO ITSUROH
MATSUMOTO TOSHIHIRO
description An electronic package comprising a semiconductor chip mounted on a substrate is formed by bonding a structure which covers at least an outer surface of the semiconductor chip and has the same or about the same thermal expansion coefficient as the substrate to the semiconductor chip's side surface of the substrate. This reduces warp and deformation caused by temperature changes during package operation.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6294831B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6294831B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6294831B13</originalsourceid><addsrcrecordid>eNrjZLB1zUlNLinKz8tMVihITM5OTE9VKM8syVBIys9LSU1RKC4pKk0uKS1KVUjMS1HITS3JyE9RyE9TyE3MzsxL52FgTUvMKU7lhdLcDApuriHOHrqpBfnxqcVAA1PzUkviQ4PNjCxNLIwNnQyNiVACAMNyL-M</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic package with bonded structure and method of making</title><source>esp@cenet</source><creator>SHISHIDO ITSUROH ; MATSUMOTO TOSHIHIRO</creator><creatorcontrib>SHISHIDO ITSUROH ; MATSUMOTO TOSHIHIRO</creatorcontrib><description>An electronic package comprising a semiconductor chip mounted on a substrate is formed by bonding a structure which covers at least an outer surface of the semiconductor chip and has the same or about the same thermal expansion coefficient as the substrate to the semiconductor chip's side surface of the substrate. This reduces warp and deformation caused by temperature changes during package operation.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20010925&amp;DB=EPODOC&amp;CC=US&amp;NR=6294831B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20010925&amp;DB=EPODOC&amp;CC=US&amp;NR=6294831B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHISHIDO ITSUROH</creatorcontrib><creatorcontrib>MATSUMOTO TOSHIHIRO</creatorcontrib><title>Electronic package with bonded structure and method of making</title><description>An electronic package comprising a semiconductor chip mounted on a substrate is formed by bonding a structure which covers at least an outer surface of the semiconductor chip and has the same or about the same thermal expansion coefficient as the substrate to the semiconductor chip's side surface of the substrate. This reduces warp and deformation caused by temperature changes during package operation.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB1zUlNLinKz8tMVihITM5OTE9VKM8syVBIys9LSU1RKC4pKk0uKS1KVUjMS1HITS3JyE9RyE9TyE3MzsxL52FgTUvMKU7lhdLcDApuriHOHrqpBfnxqcVAA1PzUkviQ4PNjCxNLIwNnQyNiVACAMNyL-M</recordid><startdate>20010925</startdate><enddate>20010925</enddate><creator>SHISHIDO ITSUROH</creator><creator>MATSUMOTO TOSHIHIRO</creator><scope>EVB</scope></search><sort><creationdate>20010925</creationdate><title>Electronic package with bonded structure and method of making</title><author>SHISHIDO ITSUROH ; MATSUMOTO TOSHIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6294831B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SHISHIDO ITSUROH</creatorcontrib><creatorcontrib>MATSUMOTO TOSHIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHISHIDO ITSUROH</au><au>MATSUMOTO TOSHIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic package with bonded structure and method of making</title><date>2001-09-25</date><risdate>2001</risdate><abstract>An electronic package comprising a semiconductor chip mounted on a substrate is formed by bonding a structure which covers at least an outer surface of the semiconductor chip and has the same or about the same thermal expansion coefficient as the substrate to the semiconductor chip's side surface of the substrate. This reduces warp and deformation caused by temperature changes during package operation.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Electronic package with bonded structure and method of making
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T08%3A49%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHISHIDO%20ITSUROH&rft.date=2001-09-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS6294831B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true