Combined chemical mechanical polishing and reactive ion etching process

A process of planarizing the surface of a semiconductor substrate. The process begins by forming patterned raised and recessed regions on the surface of the semiconductor substrate. A layer of material then is formed over the patterned raised and recessed regions. The layer is subjected to a chemica...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MACDONALD MICHAEL J, MLYNKO WALTER E, MURRAY MARK P, PETERSON KIRK D, LANDERS WILLIAM F, FERENCE THOMAS G
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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