Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system

Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system

A cathode assembly having a pedestal and a detachable susceptor. Various contact assemblies containing a canted spring are utilized to make electrical connection between the pedestal and detachable susceptor. The canted spring has coils that are tilted in one direction and joined end to end to form...

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Hauptverfasser: LU CHIA-AU BILL, HAUSMANN GILBERT, GRISTI RAYMOND, SATITPUNWAYCHA PETER, STIMSON BRADLEY O, SUBRAMANI ANANTHA, RINGOR LAWRANCE A, SUGARMAN MICHAEL N
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LU CHIA-AU BILL
HAUSMANN GILBERT
GRISTI RAYMOND
SATITPUNWAYCHA PETER
STIMSON BRADLEY O
SUBRAMANI ANANTHA
RINGOR LAWRANCE A
SUGARMAN MICHAEL N
description A cathode assembly having a pedestal and a detachable susceptor. Various contact assemblies containing a canted spring are utilized to make electrical connection between the pedestal and detachable susceptor. The canted spring has coils that are tilted in one direction and joined end to end to form a doughnut shape. Such a spring creates multiple parallel self-loading electrical connections via the turns of the spring. The turns act like electrical wires to ensure reliable RF electrical energy transfer. The canted spring contact of the present invention allows for flat contact between the pedestal and the chuck.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system
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