Rolling ball connector

An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would...

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Bibliographische Detailangaben
Hauptverfasser: BENENATI JOSEPH A, PIERSON MARK V, ELLIS WAYNE F, CHEN WILLIAM T, KNICKERBOCKER JOHN U, TONTI WILLIAM R, ZALESINSKI JERZY M, BERTIN CLAUDE L, DINAN THOMAS E, HOWELL WAYNE J
Format: Patent
Sprache:eng
Schlagworte:
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