Low temperature via fill using liquid phase transport

Low temperature via fill using liquid phase transport

A method for depositing materials on a surface, having the following steps: a) obtaining a surface having at least feature thereon, the surface and the feature having a layer of first material deposited thereon, the first material not filling substantially all of the feature; b) depositing a layer o...

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Hauptverfasser: LEVINE ERNEST N, JASO MARK A, GAMBINO JEFFREY P, HOH PETER D
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LEVINE ERNEST N
JASO MARK A
GAMBINO JEFFREY P
HOH PETER D
description A method for depositing materials on a surface, having the following steps: a) obtaining a surface having at least feature thereon, the surface and the feature having a layer of first material deposited thereon, the first material not filling substantially all of the feature; b) depositing a layer of a second material on the first material, wherein the melting point of the second material is less than that of the first material, and wherein the first material is soluble in the second material at a temperature less than the melting point of the first material; and c) heating the surface to a first temperature of at least equal to the melting point of the second material and at most equal to the melting point of the first material, wherein substantially all of the via is filled with the first material.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Low temperature via fill using liquid phase transport
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