Substrate drying device, drying method and substrate dried by the same

A substrate drying device includes a reduced pressure enclosure including an airproof door, and an exhaustion device. Inside of the enclosure is caused to be a sealed state when the airproof door is closed. After a substrate to which an application material is applied is received into the reduced pressure enclosure, the airproof door is closed to make inside of the reduced pressure enclosure be an airproof state. Subsequently, inside of the reduced pressure enclosure is exhausted by the exhaustion device to perform for eliminating air bubbles in the application material and drying the application material on the substrates. The exhaustion device may include a reserve tank that has a volume capable of rapidly reducing a pressure of the internal volume of the reduced pressure enclosure to maintain a predetermined negative pressure. A rapid exhaustion of the inside of the reduced pressure enclosure is performed by connecting the reserve tank to the reduced pressure enclosure.